Semiconductor integrated circuit device including logic gate that attains reduction of power consumption and high-speed operation

ABSTRACT

A semiconductor integrated circuit device has a hierarchical power supply system for a logic circuit. Inverters are provided with power supply from a main power supply line and a sub-power supply line of a higher potential and a main ground line and a sub-ground line of a lower potential. An internal power supply voltage-down converter is placed to set the voltage of the main power supply line higher than a normal operation voltage of the higher potential. An internal supply voltage boosting circuit is placed to set the voltage of the main ground line lower than a normal operation voltage of the lower potential. When respective power supply lines are short-circuited by a switching transistor, the voltage of each power supply line can be maintained at an operation supply voltage.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to semiconductor integrated circuitdevices, and more particularly to a configuration for achievingreduction of current consumption as well as high-speed operation of asemiconductor integrated circuit device including a logic gateconstituted of a CMOS transistor.

2. Description of the Background Art

In the field of semiconductors, enhancement of integration and reductionof supply voltage are being promoted nowadays.

Since MOS transistors constituting an internal circuit have thresholdvoltage, the threshold voltage should be made smaller in order to securea high-speed operation. However, a problem of a dramatic increase in theleakage current arises if the threshold voltage is decreased.

One scheme for solving this problem is a hierarchical power supplysystem. The hierarchical power supply system employed in a conventionalsemiconductor integrated circuit device will be described using FIG. 67.

In FIG. 67, a plurality of stages of CMOS inverters X1, X2, X3 . . .connected in cascade are shown as forming one example of an internalcircuit.

CMOS inverters X1, X2 and X3 each include a PMOS transistor and an NMOStransistor. A main supply line L1, a sub-supply line L2, a main groundline L3 and a sub-ground line L4 for applying an operation supplyvoltage are arranged for inverters X1-X3.

A switching transistor T1 is placed between main supply line L1 andsub-supply line L2. Between main ground line L3 and sub-ground line L4,a switching transistor T2 is arranged.

Switching transistor T1 is brought to a conducting state in response toa hierarchical power supply control signal/φc to electrically connectmain supply line L1 and sub-supply line L2.

Switching transistor T2 is brought to the conducting state in responseto a hierarchical power supply control signal φc to electrically connectmain ground line L3 and sub-ground line L4.

One operation supply node (a node receiving a higher potential) ofinverters at the odd number stages X1, . . . each is connected tosub-supply line L2, and the other operation supply node (a nodereceiving a lower potential) is connected to main ground line L3.

One operation supply node (a node receiving a higher potential) ofinverters at the even number stages X2 . . . each is connected to mainsupply line L1, and the other operation supply node (a node receiving alower potential) is connected to sub-supply line L4.

Supply potential is applied to main supply line L1. Ground potential isapplied to main ground line L3. Voltage of main supply line L1 isreferred to as voltage Vcc, voltage of sub-supply line L2 is referred toas voltage SubVcc, voltage of main ground line L3 is referred to asvoltage Vss, and voltage of sub-ground line L4 is referred to as voltageSubVss.

Referring to FIGS. 68 and 69, an operation of the conventionalhierarchical power supply system shown in FIG. 67 is hereinafterdescribed.

FIG. 68 illustrates a timing chart showing variation of supply potentialin the conventional hierarchical power supply system shown in FIG. 67,and FIG. 69 is provided for describing voltage conditions of respectiveinverters X1, . . . in a standby cycle.

As shown in FIG. 69, inverters X1, . . . each include a PMOS transistorP1 and an NMOS transistor N1.

An input signal IN which is brought to an H level and an L levelrespectively in the standby cycle and an activate cycle is input to theinternal circuit illustrated in FIG. 69. In the standby cycle, controlsignal φc is set at the L level. Accordingly, switching transistors T1and T2 are in OFF state in the standby cycle. In the active cycle,control signal φc is set at the H level.

Upon transition from the active cycle to the standby cycle (at time t0and t2 of FIG. 68), voltage SubVcc of sub-supply line L2 graduallydecreases from the voltage Vcc level of main supply line L1 due to theload capacitor. On the other hand, voltage SubVss of sub-ground line L4gradually changes to a higher level from voltage (ground supply voltage)Vss of main ground line L3 due to the load capacitor.

Upon transition from the standby cycle to the active cycle (at time t1of FIG. 68), control signal φc attains the H level. Accordingly,switching transistors T1 and T2 are brought to ON state. Voltage SubVccof sub-supply line L2 is charged to the voltage Vcc level of main supplyline L1. Voltage SubVss of sub-ground line L4. approaches to the voltageVss level of main ground line L3.

Referring to FIG. 69, in the standby cycle, inverter X2 receives asignal of ground supply voltage Vss which is an inverted one of inputsignal IN. Accordingly, in inverter X2, PMOS transistor P1 attains ONstate, and a connection node between PMOS transistor P1 and NMOStransistor N1 is set at voltage Vcc level of main supply line L1. SinceNMOS transistor N1 receives voltage SubVcc of sub-ground line L4 higherthan ground supply voltage Vss, the gate voltage becomes smaller thanthe source voltage. The leakage current in inverter X2 is thusrestricted.

Inverter X3 receives a signal of voltage Vcc of main supply line L1.Accordingly, NMOS transistor N1 is brought to ON state, and a connectionnode between PMOS transistor P1 and NMOS transistor N1 is set at voltageVss of main ground line L3. Since PMOS transistor P1 receives voltageSubVcc of sub-supply line L2 lower than voltage Vcc of main supply lineL1, the gate voltage becomes higher than the source voltage.Accordingly, the leakage current in inverter X3 is restricted.

However, in the conventional hierarchical power supply system, as shownin FIG. 68, at the instant of transition from the standby cycle to theactive cycle, switching transistors T1 and T2 are brought into ON stateto cause a sudden voltage change of sub-supply line L2 and sub-groundline L4 (referred to as voltage drop).

Further, when switching transistor T1 and T2 attain ON state, thejunction capacitance thereof causes voltage SubVcc of sub-supply line L2to become a level slightly lower than voltage Vcc of main supply line L1and causes voltage SubVss of sub-ground line L4 to keep a level slightlyhigher than voltage Vss of main ground line L3.

If the internal circuit operates in this state, a problem arises that anoperation feature satisfying a desired condition cannot be obtained andit takes time to define an output from the internal circuit.

In addition, current consumption of a semiconductor integrated circuitdevice should be effectively decreased according to an operation timing.

SUMMARY OF THE INVENTION

The present invention provides a semiconductor integrated circuit devicethat can operate with low current consumption and at a high-speed.

The invention further provides a semiconductor integrated circuit devicethat can operate with low current consumption and at a high-speedaccording to an operation mode.

The present invention further provides a semiconductor integratedcircuit device that can monitor the leakage current to adjust currentconsumption using the result of the monitoring.

A semiconductor integrated circuit device according to one aspect of thepresent invention includes a main supply line, a sub-supply line, acoupling circuit for electrically coupling the main supply line and thesub-supply line in an active cycle and for electrically uncoupling themain supply line and the sub-supply line in a standby cycle, a logiccircuit having a first logic gate operating with voltage on the mainsupply line as an operation supply voltage, applying a prescribedlogical processing based on a supplied input and outputting a resultantone, and having a second logic gate operating with voltage on thesub-supply line as an operation supply voltage, applying a prescribedlogical processing based on a supplied input and outputting a resultantone, and a voltage control circuit for controlling voltage on the mainsupply line to apply to the logic circuit a prescribed operation supplyvoltage required for ensuring the operation of the logic circuit in theactive cycle.

It is therefore a principal advantage in the above aspect of the presentinvention to be able to reduce the leakage current in the standby cycleby employing the hierarchical power supply system to control supplyvoltage applied to the logic circuit. An operation speed of the logic inthe active cycle can be prevented from being decreased by securing anoperation supply voltage in the active cycle. Further, generation of thevoltage drop can be restricted by controlling voltage on each supplyline.

In particular, the leakage current in the standby cycle can be reducedand an operation supply voltage in the active cycle can be secured byadjusting voltage on a supply line that applies a higher operationsupply potential.

In particular, the leakage current in the standby cycle can be decreasedand an operation supply voltage in the active cycle can be secured byadjusting voltage on a supply line that applies a lower operation supplypotential.

In particular, the leakage current in the standby cycle can be reducedand an operation supply voltage in the active cycle can be secured byadjusting voltage on supply lines that apply a higher operation supplypotential and a lower operation supply potential respectively.

In particular, current consumption of the entire circuit can be reducedby independently controlling voltage on a supply line in the standbycycle and that in the active cycle.

In particular, at least one switching transistor is provided forshort-circuiting supply lines. Resistance of the supply lines can thusbe decreased.

In particular, at least one circuit for setting voltage of thesub-supply line at voltage of the main supply line in the active cycleis provided as a coupling circuit for short-circuiting the supply lines.Accordingly, the voltage drop generated when the supply lines areshort-circuited can be prevented. In addition, the processing speed ofthe logic circuit can be improved.

In particular, diode-connected transistors are placed between supplylines. Then the potential difference between the main supply line andthe sub-supply line can be restricted below a fixed value.

In particular, control timing of the voltage of the supply line in thehierarchical power supply system is changed according to an operationmode. Accordingly, current consumption of an internal circuit whichoperates immediately after activation of the chip and an internalcircuit which thereafter operates can be decreased independently.

In particular, the voltage of the supply line in the hierarchical powersupply system can be controlled according to an operation mode. Thepotential of the main supply line and the sub-supply line can thus becontrolled according to an operation mode.

In particular, the leakage current in the hierarchical power supplysystem can be monitored according to a test mode.

The leakage current flowing through the switching transistor of thehierarchical power supply system in the standby cycle can be reduced byapplying negative bias to the gate electrode of the switching transistorin the standby cycle. Further, bias control with at least three valuesprevents raise of substrate voltage occurring with charging/dischargingof the gate electrode of the switching transistor, resulting in increasein operable range of the memory cell.

A semiconductor integrated circuit device according to another aspect ofthe present invention includes a main supply line, a sub-supply line, acoupling circuit for electrically coupling the main supply line and thesub-supply line in an active cycle and electrically uncoupling the mainsupply line and the sub-supply line in a standby cycle, a logic circuithaving a first logic gate operating with voltage on the main supply lineas an operation supply voltage, applying a prescribed logical processingbased on a supplied input and outputting a resultant one, and having asecond logic gate operating with voltage on the sub-supply line as anoperation supply voltage, applying a prescribed logical processing basedon a supplied input and outputting a resultant one, and a monitorcircuit for monitoring the leakage current in the logic circuit.

A principal advantage of the above aspect of the present invention isaccordingly that the leakage current in the hierarchical power supplysystem can be externally monitored.

A semiconductor integrated circuit device according to still anotheraspect of the present invention includes a semiconductor substratehaving a main surface, a main supply line and a sub-supply lineextending separately on the main surface of the semiconductor substrate,a coupling circuit electrically coupling the main supply line and thesub-supply line in an active cycle and electrically uncoupling the mainsupply line and the sub-supply line in a standby cycle, a logic circuithaving a first logic gate operating with voltage of the main supply lineas an operation supply voltage and applying a prescribed logicalprocessing based on a supplied input to output a resultant one, andhaving a second logic gate operating with voltage of the sub-supply lineas an operation supply voltage and applying a prescribed logicalprocessing based on a supplied input to output a resultant one, a firstimpurity region formed in the semiconductor substrate to be electricallyconnected to a portion of at least one of the main supply line and thesub-supply line extending between the coupling circuit and the logiccircuit, and a second impurity region formed in the semiconductorsubstrate to form pn junction between the first impurity region anditself.

A principal advantage in the above aspect of the invention is that ajunction capacitance can be produced by the pn junction formed by thefirst and second impurity regions. The potential of at least one of themain and sub-supply lines can thus be fixed to reduce drop in the powersupply occurring with the circuit operation. The drop in the powersupply can further be reduced by arranging a number of such junctioncapacitances at different places. An active region of the logic gateportion is surely formed by arranging the first impurity region next tothe region where the first and second logic gates are formed.

The first and second impurity regions are constructed to form thejunction capacitance. Accordingly, potential of at least one of the mainand sub-supply lines can be fixed, resulting in reduction in the drop ofthe power supply occurring with the circuit operation.

The junction capacitance refers to the one between potentials of thesame value and with different phases. The potential can be fixed moreeffectively by fixing both ends of the junction capacitance with thesame potentials having different noise phases.

The junction capacitance refers to the one between the impurity regionelectrically connected to the main supply line and the impurity regionelectrically connected to the sub-supply line. The potential can befixed more effectively since the potentials of the main and sub-supplylines can be fixed by the junction capacitance.

The junction capacitance refers to the one between an impurity regionreceiving Vcc potential and an impurity region receiving Vss potential.The Vcc potential and the Vss potential can be fixed by the junctioncapacitance and the potential can be more effectively fixed accordingly.

The foregoing and other objects, features, aspects and advantages of thepresent invention will become more apparent from the following detaileddescription of the present invention when taken in conjunction with theaccompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic block diagram showing a configuration of asemiconductor memory device 1000 of the first embodiment of the presentinvention.

FIG. 2 shows a concept of a configuration for distributing an internalclock signal int.CLK in semiconductor memory device 1000.

FIG. 3 is a schematic block diagram showing a configuration of anaddress bus and a command data bus in semiconductor memory device 1000.

FIG. 4 shows a hierarchical power supply system of a semiconductorintegrated circuit device according to the first embodiment of theinvention.

FIG. 5 is a timing chart provided for describing an operation of thehierarchical power supply system illustrated in FIG. 4.

FIG. 6 shows a structure of a main portion of a semiconductor integratedcircuit device 2000 according to the second embodiment of the invention.

FIG. 7 shows a structure of a circuit which generates a control signalDLCCO according to the second embodiment of the invention.

FIG. 8 shows a configuration of a hierarchical power supply systemaccording to the second embodiment of the invention.

FIG. 9 shows a configuration of the hierarchical power supply systemaccording to the second embodiment of the invention.

FIG. 10 shows a timing chart illustrating an operation of thehierarchical power supply system in semiconductor integrated circuitdevice 2000 according to the second embodiment of the invention.

FIG. 11 shows a structure of a main portion of a semiconductorintegrated circuit device 3000 according to the third embodiment of theinvention.

FIG. 12 is a timing chart showing an operation of a hierarchical powersupply system in semiconductor integrated circuit device 3000 accordingto the third embodiment of the invention.

FIG. 13 is a schematic block diagram showing a structure of a rowpredecoder 36 according to the fourth embodiment of the invention.

FIG. 14 is a schematic block diagram illustrating a structure of aflip-flop circuit 224, a driver circuit 226 and a level keep circuit 228illustrated in FIG. 13.

FIG. 15 is a timing chart provided for describing an operation of a rowpredecoder 36 illustrated in FIG. 13.

FIG. 16 is a timing chart provided for describing an operation in thecase in which a plurality of different banks are successively accessedin the structure of row predecoder 36 shown in FIG. 13.

FIG. 17 is a schematic block diagram showing a structure of a columnpredecoder 34 according to the fourth embodiment of the presentinvention.

FIG. 18 is a timing chart provided for describing a reading operation ofcolumn predecoder 34 shown in FIG. 17.

FIG. 19 is a timing chart provided for describing a reading operation ofcolumn predecoder 34 shown in FIG. 17.

FIG. 20 shows a structure of a hierarchical power supply systemaccording to the fifth embodiment of the invention.

FIG. 21 shows a structure of a simulation applied for making sure of anoperation of a DLCC system according to the fifth embodiment of theinvention.

FIG. 22 shows a structure of a load inverter 135 connected to aninverter chain shown in FIG. 21.

FIG. 23 shows specific conditions of the simulation illustrated in FIG.21.

FIG. 24 graphically shows simulation waveforms of a conventionalhierarchical power supply system.

FIG. 25 graphically shows simulation waveforms of the DLCC system.

FIG. 26 graphically shows an inverter speed for comparison in thesimulation according to the fifth embodiment of the invention.

FIG. 27 shows conditions for measuring delay of the inverter chain inthe DLCC system.

FIG. 28 graphically shows delay of the inverter chain generated when thevoltage of the supply line recovers after it changed.

FIG. 29 shows a structure of a main portion of leakage current testcircuits 120 a and 120 b according to the sixth embodiment of theinvention.

FIG. 30 shows a structure of a main portion of a leakage current testcircuit according to the seventh embodiment of the invention.

FIGS. 31 and 32 are circuit diagrams illustrating examples of theleakage current test circuit according to the seventh embodiment of theinvention.

FIG. 33 illustrates a structure of a main portion of a leakage currenttest circuit 126 according to the eighth embodiment of the invention.

FIGS. 34 and 35 illustrate a structure of a hierarchical power supplysystem according to the ninth embodiment of the invention.

FIG. 36 is a circuit diagram illustrating a specific structure of aswitch control circuit 600 according to the ninth embodiment of theinvention.

FIG. 37 is a timing chart provided for describing an operation of theswitch control circuit shown in FIG. 36.

FIG. 38 is a circuit diagram illustrating a specific structure of aswitch control circuit 620 according to the ninth embodiment of theinvention.

FIG. 39 is a timing chart provided for describing an operation of theswitch control circuit shown in FIG. 38.

FIG. 40 illustrates another structure of the hierarchical power supplysystem according to the ninth embodiment of the invention.

FIG. 41 illustrates a functional block.

FIG. 42 is a schematic plan view illustrating a structure of asemiconductor integrated circuit device according to the tenthembodiment of the invention.

FIG. 43 is a schematic cross-sectional view along line A₁—A₁ of FIG. 42.

FIGS. 44 to 51 are plan views respectively illustrating the structureshown in FIG. 42 from the lowest layer successively.

FIGS. 52 to 59 are cross-sectional views respectively illustrating thestructure shown in FIG. 43 from the lowest layer successively.

FIG.60 is a plan view illustrating a structure of an inverter.

FIG. 61 is a plan view illustrating a structure of an NAND circuit or anNOR circuit.

FIG. 62 is a plan view illustrating a structure of a well-fixed cell.

FIG. 63 is a schematic cross-sectional view along line A₂—A₂ of FIG. 62.

FIG. 64 illustrates the structure shown in FIGS. 42 and 43 withcapacitor components.

FIG. 65 illustrates a typical array structure.

FIG. 66 is a plan view illustrating a structure where dummy gates coverthe periphery of the circuit.

FIG. 67 illustrates a structure of a conventional hierarchical powersupply system.

FIG. 68 is a timing chart showing change of the power supply potentialin the conventional hierarchical power supply system shown in FIG. 67.

FIG. 69 illustrates a standby cycle in the conventional hierarchicalpower supply system shown in FIG. 67.

FIG. 70 is a cross-sectional view illustrating dummy components arrangedaround bit lines of a DRAM.

FIG. 71 is a circuit diagram illustrating a structure of a flip-flopcircuit 224.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

(First Embodiment)

A semiconductor integrated circuit device according to the firstembodiment of the present invention will be described below. The firstembodiment of the invention provides a semiconductor integrated circuitdevice that accomplishes low current consumption and a high-speedoperation. A synchronous semiconductor memory device as an example ofthe semiconductor integrated circuit device is described referring toFIG. 1.

With reference to FIG. 1, a synchronous semiconductor memory device 1000includes a control circuit 20 which receives external control signals/RAS, /CAS, /W, /CS and the like externally supplied via a group ofexternal control signal input terminals 10, decodes those signals andgenerates internal control signals, command data buses 53 a and 53 bwhich transmit the internal control signals supplied from controlcircuit 20, and a memory cell array 100 in which memory cells arearranged in rows and columns.

Memory cell array 100 is divided into total 16 memory cell blocks 100a-100 p placed as shown in FIG. 1. For example, if the storage capacityof synchronous semiconductor memory device 1000 is 1 G bits, each memorycell block has a capacity of 64M bits. Each block has a structure whichenables it to operate independently as a bank.

Synchronous Semiconductor memory device 1000 further includes aninternal synchronous signal generation circuit 18 which receives anexternal clock signal CLK supplied to a clock signal input terminal 16,starts a synchronous operation under control by control circuit 20, andoutputs an internal clock signal int.CLK.

Internal synchronous signal generation circuit 18 generates internalclock signal int.CLK which is synchronized with external clock signalCLK by a delayed locked loop circuit (hereinafter referred to as DLLcircuit) or the like.

External address signals A0-Ai (i is a natural number) supplied via agroup of address signal input terminals 12 are taken into synchronoussemiconductor memory device 1000 in synchronization with internal docksignal int.CLK under control by control circuit 20.

Data of a prescribed number of bits of external address signals A0-Aiare supplied to a bank decoder 22 via an address bus 51 a. Decoded bankaddresses B0-B7 are transmitted to respective banks from bank decoder 22via address buses 51 b and 51 c.

Other external address signals supplied to group of address signal inputterminals 12 are transmitted to an address driver 52 via address buses50 a and 50 b. The address signals are further transmitted from addressdriver 52 to each bank (memory cell block) via an address bus 50 c.

Synchronous semiconductor memory device 1000 further includes a rowpredecoder 36 provided to each pair of memory cell blocks which latchesa row address transmitted by address bus 50 c and predecodes it undercontrol by control circuit 20, a row decoder 44 which selects acorresponding row (word line) of a memory cell block selected accordingto an output from row predecoder 36, a column predecoder 34 provided toeach memory cell block, latching a column address transmitted by addressbus 50 c and predecoding it under control by control circuit 20, acolumn predecoder line 40 which transmits an output from predecoder 34,and a column decoder 42 which selects a corresponding column (bit linepair) of a memory cell block selected according to an output from columnpredecoder line 40.

Synchronous semiconductor memory device 1000 still further includes datainput terminals DQ0-DQ15 and DQ16-DQ31 placed respectively on theoutside of a region along the longitudinal direction of a centralsection of the chip where group of external control signal inputterminals 10 and group of address signal input terminals 12 are placed,input/output buffer circuits 14 a-14 f provided respectively to datainput/output terminals DQ0-DQ31, a data bus 54 which transmits databetween the input/output buffer circuits and a corresponding memoryblock, and a read/write amplifiers 38 provided to corresponding one ofmemory cell blocks 100 a-100 p which communicates data between data bus54 and a selected memory cell column.

Signal /RAS supplied to group of external control signal input terminals10 is a row address strobe signal which starts an internal operation ofsynchronous semiconductor memory device 1000 and determines an activeperiod of the internal operation. In response to activation of signal/RAS, a circuit related to an operation of selecting a row of memorycell array 100 such as row decoder 44 is set into an active state.

Signal /CAS supplied to group of external control signal input terminals10 is a column address strobe signal that sets a circuit selecting acolumn in memory cell array 100 into the active state.

Signal /CS supplied to group of external control signal input terminals10 is a chip select signal showing that synchronous semiconductor memorydevice 1000 is to be selected, and signal /W is a signal which instructsa writing operation of synchronous semiconductor memory device 1000.

An operation of taking signals /CS, /RAS, /CAS and /W is executed insynchronization with internal clock signal int.CLK.

In synchronization with internal clock signal int.CLK, address signalssupplied to address signal input terminal group 12 are taken, and datais communicated via data input/output terminals DQ0-DQ31.

A configuration will be described using FIG. 2 for distributing internalclock signal int.CLK to input terminals of group of external controlsignal input terminals 10 and to the data input terminals DQ0-DQ15respectively in synchronous semiconductor memory device 1000 shown inFIG. 1.

Referring to FIG. 2, external clock signal CLK supplied to dock signalinput terminal 16 is supplied to internal synchronous signal generationcircuit 18 via a buffer circuit 60.

Internal clock signal int.CLK output from internal synchronous signalgeneration circuit 18 is first supplied to a buffer circuit 68. Anoutput from buffer circuit 68 is divided into two, one is supplied to abuffer circuit 70 and the other to a buffer circuit 80 respectively.

An output from buffer circuit 70 is further divided into two to besupplied to buffer circuits 72 a and 72 b respectively.

An output from buffer circuit 72 a is further divided into two to besupplied to buffer circuits 74 a and 74 b respectively.

An output from buffer circuit 72 b is also divided into two to besupplied to buffer circuits 74 c and 74 d respectively.

Outputs from buffer circuits 74 a, 74 b, 74 c and 74 d are furtherdivided into two respectively to be supplied spread to buffer circuits76 a and 76 b, buffer circuits 76 c and 76 d, buffer circuits 76 e and76 f and buffer circuits 76 g and 76 h.

In other words, an output from buffer circuit 70 is divided into twosuccessively into 8 clock signals in the end. The 8 clock signals arerespectively supplied to interconnection lines 78 a-78 h. Insynchronization with dock signals supplied from respective ends ofinterconnections 78 a-78 h, external control signals are taken fromgroup of external control signal input terminals 10.

A clock signal from an end of interconnection line 78 h is supplied tointernal synchronous signal generation circuit 18 via a replica buffercircuit 62 and a delay adjustment circuit 64. Internal synchronoussignal generation circuit 18 synchronizes phases of an output from delayadjustment circuit 64 and of external clock signal CLK supplied frombuffer circuit 60, and generates internal clock signal int.CLK.

If there is no delay adjustment circuit 64, the phase of external clocksignal CLK supplied to buffer circuit 60 and that of the clock signal oninterconnection line 78 h supplied to replica buffer circuit 62 areadjusted to be the same since buffer circuit 60 and replica buffercircuit 62 have a similar structure. The clock signal on interconnectionline 78 h and those clock signals on other interconnection lines 78 a-78g also have the same phase.

Consequently, external control signals are taken in synchronization withexternal clock signal CLK.

The reason why delay adjustment circuit 64 is provided is that theamplitude level as well as the ratio of the active duration of externalclock signal CLK to its period (duty ratio) are different from a thoseof internal clock signal int.CLK, and therefore adjustment is necessary.

Although the configuration for distributing internal clock signalint.CLK to group of external control signal input terminals 10 isdescribed above, a similar configuration is provided to group of datainput/output terminals DQ0-DQ15 as shown in FIG. 2.

Specifically, the other one of the outputs from buffer circuit 68 issupplied to buffer circuit 80 to be divided into two, and the dividedones are successively divided into two and ultimately divided into thoseoutputs of buffer circuits 86 a-86 h. In synchronization with internalclock signals output from buffer circuits 86 a-86 h, data is externallysupplied to or from group of data input/output terminals DQ0-DQ15.

Similarly, although the configuration for distributing internal docksignal int.CLK to group of external control signal input terminals 10and group of data input/output terminals DQ0-DQ15 is described above inrelation to FIG. 2, a similar configuration is provided to group ofaddress signal input terminals 12 and group of data input/outputterminals DQ16-DQ31. Those configurations enable address signals to betaken or enable data signals to be supplied or received insynchronization with external dock signal CLK.

Using FIG. 3, the structure of group of address signal input terminals12, address buses 50 a, 50 b, 50 c, 51 a, 51 b and 51 c, and commanddata buses 53 a and 53 b in the structure of synchronous semiconductormemory device 1000 shown in FIG. 1 is described hereinafter.

Data of the higher order bits of address signals supplied to a group ofaddress signal input terminals 12 a in group of address signal inputterminals 12 are output to bank address bus 51 a respectively by inputbuffers 13 a-13 c which operate in synchronization with internal docksignal int.CLK. Receiving data from bank address bus 51 a, bank decoder22 transmits decoded signals to respective memory cell blocks (banks)via bank address buses 51 b and 51 c.

Data of the lower order bits of address signals supplied to a group ofaddress signal input terminals 12 b in group of address signal inputterminals 12 are supplied to address driver 52 respectively by inputbuffers 13 d-13 g which operate in synchronization with internal docksignal int.CLK via address data buses 50 a and 50 b. Address driver 52transmits address signals to respective banks (memory cell blocks) viaaddress data bus 50 c.

Control circuit 20 receives command data supplied to group of controlsignal input terminals 10, decodes them, and transmits the decodedcommand data to respective memory cell blocks (banks) via command databuses 53 a and 53 b.

One of those banks, for example memory cell block 100 e is furtherdivided into memory cell sub-blocks 100 ea and 100 eb.

Among row predecoders 36, a row predecoder 36 a corresponds to memorycell sub-blocks 100 ea and a row predecoder 36 b corresponds to memorycell sub-blocks 100 eb. Row predecoder 36 a detects that bank 100 e isselected according to a bank address transmitted by bank address bus 51c, is activated when it detects that a row-related operation isinstructed by command data bus 53 b to take address data from addressdata bus 50 c and take command data from command data bus 53 brespectively. Accordingly, row predecoder 36 a outputs a predecodedaddress signal to row decoder 44. Row predecoders 36 b-36 d operatesimilarly.

Among column predecoders 34, a column predecoder 34 a corresponding tomemory cell sub-block 100 ea takes corresponding address data fromaddress data bus 50 c when it detects that memory cell block 100 e isselected according to a bank address transmitted by bank address bus 51c and a column-related operation is activated by command data bus 53 b.

Column predecoder 34 a predecodes the received column address data, andoutputs a predecoded column address signal for corresponding columnpredecoder line 40.

The hierarchical power supply system according to the first embodimentof the invention will be described using FIG. 4. The hierarchical powersupply system according to the first embodiment of the invention is usedfor a column-related circuit, a row-related circuit and the like.

FIG. 4 illustrates inverters X1, X2 and X3 representatively as forming astructure of an internal circuit. Inverters X1, X2 and X3 each have aPMOS transistor P1 and an NMOS transistor N1 and has a structure of aCMOS inverter. The threshold values of PMOS transistor P1 and NMOStransistor N1 are low.

In order to apply an operation supply voltage to inverters X1-X3, a mainsupply line L1, a sub-supply line L2, a main ground line L3 and asub-ground line L4 are provided.

Inverters X1 and X3 are connected between sub-supply line L2 and mainground line L3. Inverter X2 is connected between main supply line L1 andsub-ground line L4.

Between main supply line L1 and sub-supply line L2, a switchingtransistor P0 which electrically connects main supply line L1 andsub-supply line L2 in response to a hierarchical power supply controlsignal /φc is provided. Further, between main ground line L3 andsub-ground line L4, a switching transistor N0 which electricallyconnects main ground line L3 and sub-ground line L4 in response to ahierarchical power supply control signal φc is provided. Hierarchicalpower supply control signals φc and /φc are in the reverse phaserelation to each other, and control signal φc is in an active state atan H level in an active cycle.

For main supply line L1, an internal supply voltage-down converter VDC1a which generates a potential down-converted from the level of externalsupply voltage ExtVcc to a fixed potential is placed. For sub-supplyline L2, an internal supply voltage-down converter VDC1 b whichgenerates a potential down-converted from the level of external supplyvoltage ExtVcc level to a fixed potential is provided.

For main ground line L3, an internal supply voltage boosting circuitVUC1 a which generates a potential raised from the level of externalground potential ExtVss to a fixed potential is placed. For sub-groundline L4, an internal supply voltage boosting circuit VUC1 b whichgenerates the potential raised placed from the level of external groundpotential ExtVss to a fixed potential is placed.

Internal supply voltage-down converters VDC1 a and VDC1 b will bedescribed below. Internal voltage-down converter VDC1 a includes adifferential amplifier 1 a and a PMOS transistor P2 a. PMOS transistorP2 a has one conduction terminal connected to external supply voltageExtVcc and has the other conduction terminal connected to main supplyline L1. The gate electrode of PMOS transistor P2 a receives an outputfrom differential amplifier 1 a. Differential amplifier 1 a receives atits input reference voltage Vref2 and voltage Vcc of main supply lineL1.

Internal supply voltage-down converter VDC1 b includes a differentialamplifier 1 b and a PMOS transistor P2 b. One conduction terminal ofPMOS transistor P2 b is connected to external supply voltage ExtVcc, andthe other conduction terminal is connected to sub-supply line L2. Thegate electrode of PMOS transistor P2 b receives an output fromdifferential amplifier 1 b. Differential amplifier 1 b receives at itsinput reference voltage Vref1 and voltage SubVcc of sub-supply line L2.

Internal supply voltage boosting circuits VUC1 a and VUC1 b will bedescribed hereinafter. Internal supply voltage boosting circuit VUC1 aincludes a differential amplifier 2 a and an NMOS transistor N2 a. Oneconduction terminal of NMOS transistor N2 a is connected to groundpotential (ExtVss), and the other conduction terminal is connected tomain ground line L3. The gate electrode of NMOS transistor N2 a receivesan output from differential amplifier 2 a. Differential amplifier 2 areceives at its input reference voltage Vref3 and voltage Vss of mainground line L3.

Internal supply voltage boosting circuit VUC1 b includes a differentialamplifier 2 b and an NMOS transistor N2 b. NMOS transistor N2 b has oneconduction terminal connected to ground potential (ExtVss) and has theother conduction terminal connected to sub-ground line L4. The gateelectrode of NMOS transistor N2 b receives an output from differentialamplifier 2 b. Differential amplifier 2 b receives at its inputreference voltage Vref4 and voltage SubVss of sub-ground line L4.

Reference voltage Vref1, Vref2, Vref3 and Vref4 is adjusted in areference voltage generation circuit 555 which is an internal circuit.

Using the timing chart of FIG. 5, an operation of the hierarchical powersupply system shown in FIG. 4 is described.

In the standby cycle (time t0-t1 and t2-t3), hierarchical power supplycontrol signal φc is set at an L level. In this state, switchingtransistors P0 and N0 are in OFF state. Main supply line L1 andsub-supply line L2 are in a cutoff state. Main ground line L3 andsub-ground line L4 are also in the cutoff state. An input signal IN toinverter X1 is at an H level.

When an internal operation voltage is assumed to be 1.5V relative toexternal supply voltage ExtVcc of 2.5 V, voltage Vcc of main supply lineL1 is higher than 1.5V, and voltage SubVcc of sub-supply line L2 is setat approximately 1.5V. Reference voltage Vref1 and reference voltageVref2 is adjusted.)

As a result, the gate voltage (voltage Vcc) of PMOS transistor P1(inverter X3) connected to sub-supply line L2 is higher than the sourcevoltage (voltage SubVcc) thereof. The relatively negative bias isapplied to the gate electrode to decrease the leakage current.Adjustment of reference voltage Vref1 and Vref2 determines the leakagecurrent in the standby cycle.

Similarly, when the internal operation voltage is assumed to be 0.5Vrelative to external ground potential ExtVss of 0 V, voltage Vss of mainground line L3 is lower than 0.5V and potential SubVss of sub-groundline L4 is set at 0.5V.

In NMOS transistor N1 (inverter X2) connected to sub-ground line L4, thesource voltage (SubVss) is higher than the gate voltage (main groundvoltage Vss). Consequently, the relatively negative bias is applied tothe gate electrode to decrease the leakage current. The leakage currentis determined by adjusting reference voltage Vref3 and Vref4.

In the transition from the standby cycle to the active cycle (time t1),hierarchical power supply control signal φc is set at the H level.Switching transistors P0 and N0 attain ON state. Main supply line L1 andsub-supply line L2 are short-circuited. The voltage levels of mainsupply line L1 and sub-supply line L2 are respectively controlled bycorresponding internal supply voltage-down converters VDC1 a and VDC1 b,so that generation of the voltage drop can be restricted.

Main ground line L3 and sub-ground line L4 are similarlyshort-circuited. However, the voltage levels thereof are respectivelycontrolled by corresponding internal supply voltage boosting circuitsVUC1 a and VUC1 b so that generation of the voltage drop can berestricted.

The voltage level of each supply line is higher than a prescribed setvalue determined by the internal supply voltage (assumed to be 1.5V inthe first embodiment), which leads to prevention of decrease of anoperation speed of the logic in the active cycle.

(Second Embodiment)

A semiconductor integrated circuit device according to the secondembodiment of the invention is hereinafter described.

The semiconductor integrated circuit device according to the secondembodiment of the invention controls an operation supply voltageaccording to an operation timing for internal circuits respectively thatare different in the operation timing.

A structure of a semiconductor integrated circuit device 2000 of thesecond embodiment of the invention is hereinafter described using FIG.6.

The components similar to those of semiconductor integrated circuitdevice 1000 shown in FIG. 1 have the same reference characters anddescription thereof is not repeated here.

Semiconductor integrated circuit device 2000 shown in FIG. 6 includes acontrol circuit 20 a, buffers 101 and 102, an SMD circuit 18 a(synchronous mirror delay), and memory cell blocks 100 a-100 d.

Control circuit 20 a receives external control signals (/WE, /CAS, /RAS,/CS, external clock enable signal /CKE and the like) from a group ofexternal control signal input terminals 10 via a buffer 76. Controlcircuit 20 a further receives from a mode setting circuit (not shown) aburst length BL, a CAS latency CL, or a test mode signal TESTdesignating a specific test. In response to these signals, controlcircuit 20 a generates a control signal for controlling an internaloperation. According to the second embodiment, hierarchical power supplycontrol signals DLCCO and /DLCCO for maintaining a constant level duringa fixed period are output in response to chip select signal /CS asdescribed below.

Buffer 102 takes hierarchical power supply control signal DLCCO andoutputs a hierarchical power supply control signal DLCCF. Buffer 101takes hierarchical power supply control signal DLCCF (delayed) andoutputs a hierarchical power supply control signal DLCC.

A buffer 68 takes external dock signals /CLK and CLK to be output tocontrol circuit 20 a. An internal clock enable signal CKE supplied fromcontrol circuit 20 a is transmitted to SMD circuit 18 a. SMD circuit 18a generates clock for controlling the internal operation (an outputoperation or the like).

Semiconductor integrated circuit device 2000 further includes a localcircuit 105, and a center circuit 106. Center circuit 106 is the firstto start an operation when a command designating an operation of thechip is input. Local circuit 105 starts its operation delayed relativeto the operation of center circuit 106.

Hierarchical power supply control signal DLCCF is used for controllingthe potential of the power supply line in center circuit 106.Hierarchical power supply control signal DLCC is used for controllingthe potential of the power supply line in local circuit 105.

The structure of a circuit for generating hierarchical power supplycontrol signal DLCCO according to the second embodiment of the inventionwill be described using FIG. 7. A DLCCO generation circuit shown in FIG.7 includes a differential amplifier 107, buffers 108, 114 and 116, adelay circuit 109, inverters 110, 113 and 115, and a flip-flop 111.

Differential amplifier 107 includes PMOS transistors P5 a and P5 b, andNMOS transistors N5 a, N5 b and N4. Differential amplifier 107 amplifiesthe difference between chip select signal /CS and reference potential/Vref and outputs a signal /OUT. Buffer 108 receives signal /OUT andoutputs it to inverter 110 and delay circuit 109.

Delay circuit 109 delays an output signal from buffer 108 and outputs itto an NAND circuit 112. Inverter 110 inverts the output signal frombuffer 108 to output it to NAND circuit 112. Flip-flop 111 is formed ofan NAND circuit. Flip-flop 111 receives outputs from buffer 108 and NANDcircuit 112. Inverter 113 inverts an outputs from flip-flop 111. Buffer114 receives an output from inverter 113 and outputs control signal/DLCCO. Inverter 1l5 inverts the output from inverter 113. Buffer 116takes an output from inverter 115 and outputs control signal DLCCO.

Control signal DLCCO rises to the H level when chip select signal /CS isset to the L level, and keeps the H level for a fixed period.

Using FIGS. 8 and 9, a structure of the hierarchical power supply systemaccording to the second embodiment of the invention will be described.

FIGS. 8 and 9 respectively correspond to local circuit 105 and centercircuit 106.

Referring to FIGS. 8 and 9, inverters X1, . . . are representativelyshown as forming a structure of an internal circuit. Inverters X1 . . .each include a PMOS transistor P1 and an NMOS transistor N1 and has astructure of a CMOS inverter. Transistors constituting inverters X1 . .. have a low threshold value.

Switching transistors P0 a, P0 b . . . that electrically connect a mainsupply line L1 and a sub-supply line L2 in response to control signal/DLCC (or /DLCCF) are placed at prescribed intervals between main supplyline L1 and sub-supply line L2.

Between a main ground line L3 and a sub-ground line L4, switchingtransistors N0 a, N0 b . . . that electrically connect main ground lineL3 and sub-ground line L4 in response to control signal DLCC (or DLCCF)are placed at prescribed intervals.

For main supply line L1, internal supply voltage-down converters VDC3 a,VDC3 b and VDC3 c that generate potential falling from the level ofexternal supply voltage ExtVcc to a fixed potential are placed. Forsub-supply line L2, internal supply voltage-down converter VDC3 d whichgenerates potential falling from the level of external supply voltageExtVcc to a fixed potential is placed.

Internal supply voltage-down converter VDC3 a includes a differentialamplifier 3 a and a PMOS transistor P3 a. PMOS transistor P3 a has oneconduction terminal connected to external supply voltage ExtVcc and hasthe other conduction terminal connected to main supply line L1. The gateelectrode of PMOS transistor P3 a receives an output from differentialamplifier 3 a. Differential amplifier 3 a receives at its input a highreference voltage Vref5 a (1.8 V) and voltage Vcc of main supply lineL1. Differential amplifier 3 a operates in response to signal DLCC (orDLCCF).

Internal supply voltage-down converter VDC3 b includes a differentialamplifier 3 b and a PMOS transistor P3 b. PMOS transistor P3 b has oneconduction terminal connected to external supply voltage ExtVcc and theother conduction terminal connected to main supply line L1. The gateelectrode of PMOS transistor P3 b receives an output from differentialamplifier 3 b. Differential amplifier 3 b receives at its inputreference voltage Vref5 b (1.5V) and voltage Vcc of main supply line L1.

Internal supply voltage-down converter VDC3 c includes a differentialamplifier 3 c and a PMOS transistor P3 c. PMOS transistor P3 c has oneconduction terminal connected to external supply voltage ExtVcc and theother conduction terminal connected to main supply line L1. The gateelectrode of PMOS transistor P3 c receives an output from differentialamplifier 3 c. Differential amplifier 3 c receives at its inputreference voltage Vref5 c (1.5V) and voltage Vcc of main supply line L1.Differential amplifier 3 c operates in response to an act signal ACT.

Internal supply voltage-down converter VDC3 d includes a differentialamplifier 3 d and a PMOS transistor P3 d. One conduction terminal ofPMOS transistor P3 d is connected to external supply voltage ExtVcc andthe other conduction terminal thereof is connected to sub-supply lineL2. The gate electrode of PMOS transistor P3 d receives an output fromdifferential amplifier 3 d. Differential amplifier 3 d receives at itsinput reference voltage Vref5 d (1.5V) and voltage SubVcc of sub-supplyline L2. Differential amplifier 3 c operates in response to controlsignal DLCC (or DLCCF).

Internal supply voltage-down converter VDC3 a is used for decreasing theleakage current in the internal circuit. When internal supplyvoltage-down converter VDC3 a is activated, voltage Vcc of main supplyline L1 is set at 1.8 volt. In this case, voltage Vcc of main supplyline L1 is set higher than voltage SubVcc of sub-supply line L2 by 0.3V. Accordingly, the leakage current decreases.

Internal supply voltage-down converter VDC3 b is used for settingvoltage Vcc of the main supply line at 1.5V in the standby cycle. Anyintermittent operation of internal supply voltage-down converter VDC3 bis unnecessary.

Internal supply voltage-down converter VDC3 c is activated when the chipis set into the active state. The circuit supplies a relatively largecurrent required for an operation of the chip.

In response to activation of internal supply voltage-down converter VDC3a, internal supply voltage-down converter VDC3 d sets voltage SubVcc ofsub-supply line L2 at 1.5V. Internal supply voltage-down converter VDC3d may be eliminated in the structure. If internal supply voltage-downconverter VDC3 d is not used here, voltage SubVcc of sub-supply line L2is set at an arbitrary potential determined by the leakage currentrelative to voltage Vcc of main supply line L1 determined by internalsupply voltage-down converter VDC3 a.

Next, an operation of the hierarchical power supply system according tothe second embodiment will be described using FIG. 10.

In the standby cycle (time t0-t1), hierarchical power supply controlsignals DLCC and DLCCF are at the L level. Internal supply voltage-downconverters VDC3 a, VDC3 b and VDC3 d are in ON state. Internal supplyvoltage-down converter VDC3 c is in OFF state.

Voltage Vcc of main supply line L1 is set at 1.8 V, voltage SubVcc ofsub-supply line L2 is set at 1.5V, voltage Vss of main ground line L3 isset at 0 V, and voltage SubVss of sub-ground line L4 is set at a voltagelevel determined by the leakage current (higher than 0 V).

In this case, voltage Vcc of main supply line L1 is higher than voltageSubVcc of sub-supply line L2 in both of local circuit 105 and centercircuit 106. Accordingly, the leakage current can be restricted to alower level.

At the rising edge of clock signal CLK at time t1, chip select signal/CS is input. In response to the falling edge of the L level of chipselect signal /CS, hierarchical power supply control signal DLCCF risesto the H level. Subsequently, hierarchical power supply control signalDLCC rises to the H level. Act signal ACT is input.

Internal power supply voltage-down converters VDC3 a and VDC3 d are setto OFF state. (VDC3 d may be in ON state.) Internal supply voltage-downconverter VDC3 c is set into ON state.

Main supply line L1 and sub-supply line L2 are short-circuited. VoltageVcc of main supply line L1 is discharged to approach voltage SubVcc ofsub-supply line L2. Sub-supply voltage SubVcc is charged to approachvoltage Vcc of main supply line L1.

Main ground line L3 and sub-ground line L4 are short-circuited. VoltageSubVss of sub-ground line L4 is discharged to approach voltage Vss ofmain ground line L3. Voltage Vss of main ground line L3 is charged toapproach voltage SubVss of sub-ground line L4. According to consumptioncurrent in the circuit, each voltage level is discharged to approach theground potential level. These operations are first done in centercircuit 106 and next in local circuit 105.

Act signal ACT is supplied to set the chip into the active state. Duringthe period from time (t1) when the act signal ACT is input to time (t2)corresponding to three cycles, a row-related access is made. Theoperation of the memory array is started to set the word lines into theactive state. Charges are read out from the memory cells and signalsstored in the memory cells are amplified by a sense amplifier. Aftercompletion of successive operations, a column-related access is madepossible.

After the row-related access operation is completed, during the periodcorresponding to next four clocks (until time t3), the state of therow-related access is maintained. Circuits other than the circuit forretaining signals at the sense amplifier are in the state where reset ispossible.

Accordingly, after time t2, hierarchical power supply control signalsDLCCF and DLCC are set at the L level. Internal supply voltage-downconverters VDC3 a, VDC3 b, VDC3 c and VDC3 d are in ON state.

Main supply line L1 and sub-supply line L2 as well as main ground lineL3 and sub-ground line L4 are in the cutoff state. Voltage Vcc of mainsupply line L1 is charged to 1.8V, and voltage SubVcc of sub-supply lineL2 is charged to 1.5V. Voltage Vss of main ground line L3 is dischargedto 0V, and voltage SubVss of sub-ground line L4 is discharged to apotential determined by the leakage current.

Similar operations are executed for the column-related access, forexample, when a READ cycle is started (time t3). At the same time thatexecution of successive READ cycles is completed, the voltage of mainsupply line L1 is set higher than voltage SubVss of the sub-supply lineL2 in order to reduce the leakage current.

As described above, the leakage current is efficiently decreasedaccording to an operation timing of each circuit by generating thehierarchical power supply control signals according to the operationtiming.

In the cycle (from time t1 to t2 corresponding to three cycles) wherethe internal circuit is operating, a difference is generated betweenvoltage SubVcc of sub-supply line L2 and voltage Vcc of main supply lineL1. The difference generated is due to ON resistance in switchingtransistors N0 and P0. The potential difference can be decreased bylowering the impedance of the switching transistors.

(Third Embodiment)

A semiconductor integrated circuit device according to the thirdembodiment of the present invention will be described below. Thesemiconductor integrated circuit device according to the thirdembodiment controls the operation supply voltage of internal circuitsdifferent in the operation timing independently of each other.

A structure of a semiconductor integrated circuit device 3000 accordingto the third embodiment will be described using FIG. 11. The componentssimilar to those of semiconductor integrated circuit device 2000 havethe same reference characters and description thereof is omitted.

In semiconductor integrated circuit device 3000 shown in FIG. 11, ahierarchical power supply control signal DLCCF which controls a centercircuit 106 is generated based on an external clock enable signal /CKE.Input of an external control signal is made acceptable at the chip byinput of external clock enable signal /CKE.

A hierarchical power supply control signal DLCC used for controlling alocal circuit 105 corresponds to a delayed hierarchical power supplycontrol signal DLCCO output from a control circuit 20 a as in the secondembodiment. In other words, hierarchical power supply control signalsDLCCF and DLCC are generated independently of each other.

Adjustment of the voltage level in local circuit 105 and center circuit106 is accomplished, for example, by the structures shown in FIGS. 8 and9.

An operation of the hierarchical power supply system of thesemiconductor integrated circuit device according to the thirdembodiment will be described using the timing chart of FIG. 12.

Referring to FIG. 12, signals B0-B3 are those indicative of bankaddresses, a signal Row is a row-related access identify signalinstructing activation of a row-related circuit operation, a signal Clmis a column-related access identify signal instructing activation of acolumn-related circuit operation, and a signal ACT is a bank activationsignal transmitted from control circuit 20 a.

A flag signal is a signal which is held in response to that a bank isaccessed (bank is hit), a signal PC is a precharge signal transmittedfrom control circuit 20 a to instruct a precharge operation of aselected bank, and a signal APC is an all bank precharge signaltransmitted from control circuit 20 a to instruct the prechargeoperation of all banks.

A signal EQ is a local bit line equalize signal, a signal RXT is a localword line activation signal, and a signal SE is a local sense amplifieractivation signal.

A signal l.EQ is a local bit line equalize signal adapted for the bank,signal l.RXT is a local word line activation signal adapted for thebank, a signal l.SE is a local sense amplifier activation signal adaptedfor the bank, and potential MWL is a potential level of a main word linein a memory cell block (bank).

Description of the operation will be given below. External dock enablesignal /CKE is input. Hierarchical supply control signal DLCCF rises tothe H level. Main supply line L1 and sub-supply line L2 as well as mainground line L3 and sub-ground line L4 of center circuit 106 areshort-circuited. Local circuit 105 is in the standby state.

At the rising edge of dock signal CLK at time t1, decoded bank addressB3 attains the active state. A corresponding bank is selected. SignalRow is in the active state.

The level of activated act signal ACT is held as a flag signal. At thistime, hierarchical supply control signal DLCC rises to the H level. Mainsupply line L1 and sub-supply line L2 as well as main ground line L3 andsub-ground line L4 in local circuit 105 are short-circuited. Localcircuit 105 enters the active cycle.

The level of signal l.EQ falls to the L level. Signal l.RXT attains theactive state and the potential level of a main word line in a selectedrow changes to the active state (“H” level). Signal l.SE attains the Hlevel.

At time t2, hierarchical power supply control signal DLCC falls to the Llevel. The period from time t1 to t2 is the one which is necessary for arow-related control of one bank. Local circuit 105 enters the standbycycle.

From time t2 to t3, the circuit is reset in order to cut the leakagecurrent. Control signals such as signal l.SQ, l.RXT, l.SE are latched.

At time t3, precharge signal PC is supplied. Hierarchical power supplycontrol signal DLCC rises to the H level at this time. The power supplylines (L1 and L2, L3 and L4) are short-circuited in local circuit 105.

At the rising edge of clock signal CLK at time t3, decoded bank addressB3 attains the active state. A corresponding bank is selected. SignalRow is in the active state. Precharge signal PC rises to the H level.

This structure allows internal circuits which are different in theoperation timing to be controlled independently of each other. Inparticular, the timing of short-circuit of main supply line L1 andsub-supply line L2 in center circuit 106 is accelerated according to theinput start timing of signals externally supplied. As a result, theleakage current can be efficiently reduced.

(Fourth Embodiment)

A semiconductor integrated circuit device according to the fourthembodiment of the invention is to be described below. The semiconductorintegrated circuit device according to the fourth embodiment controlsthe operation supply voltage for row-related circuits and column-relatedcircuits independently of each other.

As operations of the semiconductor integrated circuit device, there arean operation of the row-related circuit which selects memory cells toobtain data and an operation of the column-related circuit whichselectively selects specific data from a plurality of selectedrow-related data and communicates the data with any external section ofthe chip.

During the row-related operation is executed, the column-relatedoperation is unnecessary. Therefore, main supply line L1 and sub-supplyline L2 are short-circuited and main ground line L3 and sub-ground lineL4 are short-circuited in the row-related circuit when a row-relatedcommand is input. The column related circuit maintains the standby stateto reduce the leakage current.

During the column-related operation is executed, the row-relatedoperation is unnecessary. Therefore, the main supply line L1 andsub-supply line L2 are short-circuited and the main ground line L3 andsub-ground line L4 are short-circuited in the column-related circuit.The row-related circuit maintains the standby state to reduce theleakage current.

The row-related circuit is further classified into a section related torow-related address selection, a section related to word selection, asection related to activation of a sense amplifier, and the like. Thesesections operate successively with different timing after input of a rowaddress. Accordingly, for each section, main supply line L1 andsub-supply line L2 are short-circuited and main ground line L3 andsub-ground line L4 are short-circuited according to the operationtiming.

The column-related circuit is further classified into a section relatedto column-related address selection, a section related to activation ofa selected line, a section related to a reading operation, a sectionrelated to a writing operation and the like. These sections aresuccessively operated with different timing. Therefore, for eachsection, main supply line L1 and sub-supply line L2 are short-circuited,and main ground line L3 and sub-ground line L4 are short-circuitedaccording to the operation timing.

Specific examples are provided for description. The entire structure isthe same as that of semiconductor integrated circuit device 1000 of thefirst embodiment shown in FIG. 1 and description thereof is omitted. Anyof systems according to the first and the second embodiments may beemployed as a hierarchical power supply system.

Referring to FIG. 13, a structure of a row predecoder 36 of the fourthembodiment will be described.

A command data bus 53 b transmits signal Row instructing to activate arow-related circuit operation, signal Clm instructing to activate acolumn-related circuit operation, signal ACT instructing to activate acircuit operation of the internal circuit, signal PC instructing reset(precharge) of the bank, signal APC instructing precharge of all banks,signal EQ instructing to cancel equalization of bit lines and todisconnect an unused bit line by a sense amplifier, signal RXTinstructing to activate a word line, signal SE instructing to activatethe sense amplifier and the like.

A bank address bus 51 c transmits bank address signals B0-B7 decoded bya bank decoder 22. An address bus 50 c transmits address signalssupplied from an address driver 52.

When one of the bank address signals, for example, bit data B7 attainsthe active state and signal Row attains the active state, a signal inthe active state is output from an AND circuit 203, and accordingly anactive one-shot pulse is output from a one-shot pulse generation circuit204.

In response, a driver circuit 206 is activated, the level of signal ACTis taken to be kept by a level hold circuit 208.

Similarly, in response to the signal supplied from one-shot pulsegeneration circuit 204, a driver circuit 210 is activated. Receiving thelevel of signal PC, a level hold circuit 212 keeps the level. Receivingan output from driver circuit 210, a one-shot pulse generation circuit214 outputs a reset signal to level hold circuit 208. In response to anoutput signal from level hold circuit 208, a driver circuit 220 isactivated, receives signal EQ and outputs it. An NOR circuit 222,receiving signal APC and a signal from one-shot pulse generation circuit214, outputs a result of NOR operation. A flip-flop circuit 224 is setaccording to an output from driver circuit 220 and reset according to anoutput from NOR circuit 222. A driver circuit 226 is activated by ahierarchical supply control signal SCRC described below, receives anoutput from flip-flop circuit 224 and outputs it. The output level ofdriver circuit 226 is kept by a level hold circuit 228. The output levelof level hold circuit 228 is supplied to a corresponding memory cellblock as signal l.EQ.

Similarly, a flip-flop circuit 234 is set by an output from an inverter230 activated according to a signal from level hold circuit 208 andreceiving the level of signal RXT transmitted via a command data bus 53b as an input, and reset by an output from an NOR circuit 232 receivingan output from one-shot pulse generation circuit 214 and the level ofsignal APC transmitted via command data bus 53 b.

The structures of flip-flop circuit 224, driver circuit 226 and levelkeep circuit 228 shown in FIG. 13 are hereinafter described using FIG.14.

Referring to FIG. 14, flip-flop circuit 224 includes cross-connectedNAND circuits 2240 and 2260, a switch circuit 2274 switching the stateof supplying ground potential to the cross-connected NAND circuits 2240and 2260, and a switch circuit 2254 switching the state of supplyingsupply potential Vcc to NAND circuits 2240 and 2260. Switch circuits2254 and 2274 constitute a hierarchical power supply.

Referring to FIG. 71, one example of the structure of flip-flop circuit224 is specifically described. FIG. 71 is a circuit diagram illustratingthe structure of flip-flop circuit 224. Referring to FIG. 71, flip-flopcircuit 224 includes NAND circuits 2240 and 2260 connected for formingan RS flip-flop, PMOS transistors 4443 and 4444 connected in parallelwith each other on the power supply side of NAND circuit 2240, NMOStransistors 4445 and 4446 connected in parallel with each other on theground side of NAND circuit 2240, PMOS transistors 4447 and 4448connected in parallel with each other on the power supply side of NANDcircuit 2260, NMOS transistors 4449 and 4450 connected in parallel witheach other on the ground side of NAND circuit 2260, an NAND circuit4451, inverters 4452 and 4453, an NMOS transistor 4454 connected betweenan output node of NAND circuit 2240 and a main ground line (4016), and aPMOS transistor 4455 connected between a main power supply line (4010)and an output node of NAND circuit 2260.

Preferably, the threshold of transistors 4443-4450 is set at a valuehigher than the threshold of other transistors (transistors in NANDcircuits 2240 and 2260, for example).

NAND circuit 4451 receives a reset signal RESET and a power on resetsignal /POR. A signal from NAND circuit 4451 is supplied to NAND circuit2260 via inverter 4452. Power on reset signal /POR is directly suppliedto the gate of transistor 4455 and supplied to the gate of transistor4454 via inverter 4453. Power on reset signal /POR is at a logical low(L) level only for a prescribed time from the time at which the powersupply is turned on, and accordingly transistors 4454 and 4455 are bothturned on. NAND circuit 2240 outputs a signal of L level and NANDcircuit 2260 outputs a signal of logical high (H) level. Flip-flopcircuit 224 is thus reset when the power supply is turned on.

In the operation mode, a control signal SCRC is at H level and a controlsignal /SCRC is at L level, so that transistors 4444, 4446, 4448 and4450 are all turned on. NAND circuits 2240 and 2260 are respectivelyprovided with power supply voltage Vcc and ground voltage Vss, andaccordingly flip-flop circuit 224 normally operates.

In the standby mode, control signal SCRC is at L level and controlsignal /SCRC is at H level, so that transistors 4444, 4446, 4448 and4450 are all turned off. When flip-flop 224 outputs a signal of H level,that is, NAND circuit 2240 outputs a signal of H level and NAND circuit2260 outputs a signal of a L level, transistors 4443 and 4449 are turnedon and transistors 4445 and 4447 are turned off. As a result, althoughpower supply voltage Vcc is output from NAND circuit 2240 as an outputof H level, subthreshold leakage current flowing through NAND circuit2240 is reduced. Although ground voltage Vss is output from NAND circuit2260 as an output of L level, subthreshold leakage current flowingthrough NAND circuit 2260 is reduced.

When flip-flop circuit 224 outputs a signal of L level, that is, NANDcircuit 2240 outputs a signal of L level and NAND circuit 2260 outputs asignal of H level, transistors 4445 and 4447 are turned on andtransistors 4443 and 4449 are turned off. As a result, although groundvoltage Vss is supplied from NAND circuit 2240 as an output signal of Llevel, subthreshold leakage current flowing through NAND circuit 2240 isdecreased. Further, although power supply voltage Vcc is output fromNAND circuit 2260 as an output signal of H level, the subthresholdleakage current flowing through NAND circuit 2260 is reduced.

Driver circuit 226 includes an NAND circuit 2286 having one input nodereceiving signal SCRC and the other receiving one output signal fromflip-flop circuit 224, an NAND circuit 2288 having one input nodereceiving signal SCRC and the other input node receiving the otheroutput from flip-flop circuit 224, an NMOS transistor 2290 having itsgate potential controlled by an output from NAND circuit 2286 andreceiving at its source hierarchical power supply potential SubVss, anda PMOS transistor 2292 receiving an output from NAND circuit 2288 at itsgate and receiving hierarchical supply potential SubVcc at its source.The drain of NMOS transistor 2290 and the drain of PMOS transistor 2292are connected, and the potential level of this connection node is anoutput potential from driver circuit 226.

Level hold circuit 228 is a latch circuit activated by signal SCRC2.When signal SCRC is in the active state, NAND circuits 2240 and 2260receive supply potential to operate. NAND circuits 2240 and 2260 arestructured to generate self bias to reduce the leakage current duringthe period in which signal SCRC is inactivated (hierarchical powersupply system).

Referring to FIG. 13, driver circuit 236 receives an output fromflip-flop circuit 234 to be activated by signal SCRC.

The output level of driver circuit 236 is kept by level hold circuit238, and the output level of level hold circuit 238 is output to acorresponding memory cell block as signal l.RXT.

Flip-flop circuit 244 is set by an output from inverter 240 whichreceives signal SE transmitted via command data bus 53 b and isactivated according to an output level of level hold circuit 208, and isreset according to an output from NOR circuit 242 which receives anoutput signal from one-shot pulse generation circuit 214 and the levelof signal APC transmitted via command data bus 53 b. Driver circuit 246receives an output from flip-flop circuit 244 and is activated by signalSCRC2. The output level of driver circuit 246 is kept by level holdcircuit 248, and the output level of level hold circuit 248 is suppliedas signal l.SE to a corresponding memory cell block.

A latch circuit 250 is reset in response to activation of signal SCRC,activated in response to activation of one-shot pulse generation circuit204, and keeps an address signal transmitted via address bus 50 c. Anoutput from latch circuit 250 is transmitted to a redundancy addressdecoder (not shown) and to a predecoder 252. The result of predecodingis supplied to a driver circuit 254.

An output from driver circuit 254 is kept by a level hold circuit 256and level hold circuit 256 outputs it to a corresponding row predecoderline.

Driver circuit 254 is activated by a driver control circuit 302 which iscontrolled by a value of the flag kept by level hold circuit 208 as wellas signal SCRC.

Driver control circuit 302 is a circuit for maintaining, wheninactivated after activated once, driver circuit 254 in the inactivestate during an active period of act signal ACT, even if signal SCRCagain attains the active state.

By controlling driver circuit 254 by driver control circuit 302, apredecoder address signal kept by level hold circuit 256 is preventedfrom being reset due to the active state of driver circuit 254 when arow address is once taken into level hold circuit 256 and thereaftersignal SCRC is again activated.

If driver circuit 254 is inactivated after it attains the active state,latch circuit 250 which is a circuit taking an address signal andpredecoder 252 are reset.

In the structure of row predecoder 36 shown in FIG. 13, a region 301including level hold circuits 208, 212, 228, 238 and 248, level holdcircuit 256, and corresponding memory cell blocks corresponds to aregion which is not controlled by the hierarchical power supply controlsignal. The region 301 operates with power supply potential Vcc andground potential Vss as power supply potential in both of the standbystate and the active state.

A region other than region 301 (a region 202) in row predecoder 36corresponds to a region which is controlled by hierarchical power supplycontrol signal SCRC. The region operates by receiving supply potentialVcc and ground potential Vss in the period in which hierarchical powersupply control signal SCRC is in the active state. The region operateswith the potential lower than supply potential Vcc and the potentialhigher than ground potential Vss respectively as supply potential duringthe period in which hierarchical power supply control signal SCRC is inthe inactive state (“L” level).

During a period in which level hold circuit 208 maintains its hold levelafter signal RDDRV is activated once, signal RDDRV is never set into theactive state even if signal SCRC attains the active state afterinactivated to be reset, owing to driver control circuit 302.

An operation of row predecoder 36 shown in FIG. 13 is next describedusing the timing chart of FIG. 15.

Referring to FIG. 15, signal SCRC2 is a signal generated by a controlcircuit 20 for reset of level hold circuits 228, 238, 248 and the like.Signal RDDRV is a signal for controlling an operation of driver circuit254.

Signals B0-B7 are signals indicative of bank addresses, signal Row is arow-related access identify signal instructing to activate a row-relatedcircuit operation, signal Clm is a column-related access identify signalinstructing to activate a column-related circuit operation, and signalACT is a bank activation signal transmitted from control circuit 20.

The flag signal is a signal kept by level hold circuit 208 in responseto that a bank is accessed (bank is hit), signal PC is a prechargesignal transmitted from control circuit 20 and instructing a prechargeoperation of a selected bank, and signal APC is an all bank prechargesignal transmitted from control circuit 20 and instructing a prechargeoperation of all banks.

Signal l.EQ is a local bit line equalize signal kept by level holdcircuit 228, signal l.RXT is a local word line activation signal kept bylevel hold circuit 238, signal l.SE is a local sense amplifieractivation signal kept by level hold circuit 248, and potential MWLcorresponds to a potential level of a main word line in a memory cellblock (bank). Signal Add.latch is an address signal kept by level holdcircuit 256.

Next, the operation is described. At the rising edge of clock signal CLKat time t1, bit B7 of a decoded bank address is in the active state toallow a corresponding bank to be selected. At this time, signal Row isalso in the active state and an active one-shot pulse is output fromone-shot pulse generation circuit 204. Accordingly, signal ACT in theactive state transmitted by command data bus 53 b is driven by drivercircuit 206, and the level of the active act signal ACT is kept by levelhold circuit 208 as a flag signal.

Accordingly, driver control signal RDDRV supplied from driver controlcircuit 302 attains the active state (“H” level).

Hierarchical power supply control signal SCRC and signal SCRC2 attainthe active state. The circuits in region 202 all operate by receivingsupply potential Vcc and ground potential Vss. A row address-relatedswitch (switch transistor for short-circuit) is set to ON state toshort-circuit power supply lines in the row address-related circuit.

In response to activation of the flag signal, the level of signal EQtransmitted by command data bus 53 b is kept by flip-flop circuit 224.The level of signal EQ taken by flip-flop circuit 224 is driven bydriver circuit 226 to be kept by level keep circuit 228 as local bitline equalize signal l.EQ.

At time t2, signal RXT transmitted by command data bus 53 b attains theactive state and the level thereof is taken by flip-flop circuit 234.Accordingly, level hold circuit 238 maintains the level of local wordline activation signal l.RXT in the active state.

In the period from time t1 to t2, a word line-related switch is set intoON state to short-circuit power supply lines in the circuit forselecting word lines.

A sense-related switch is set into ON state to short-circuit powersupply lines in the peripheral circuitry of the sense amplifier.

At time t3, the level of signal SE transmitted by command data bus 53 battains the active state and the level thereof is taken by flip-flopcircuit 244.

Accordingly, level hold circuit 248 maintains the level of local senseamplifier activation signal l.SE in the active state.

In response to activation of local word line activation signal l.RXT,the potential level of a main word line in a selected row changes to theactive state (“H” level).

At the second clock (time t4), the row address-related switch is setinto OFF state. After that (time t5), the word line-related switch isset into OFF state. In each circuit, power supply lines are set into thecutoff state.

An address signal transmitted via address bus 50 c is latched by latchcircuit 250 and predecoded by predecoder 252. The output of predecoder252 is driven by driver circuit 254 and the level of row predecoder linePDL is driven to a corresponding level. The level of row predecoder linePDL allows signal SCRC to be in the inactive state (“L” level) at timet6. Similarly, RDDRV is set into the inactive state.

The period from time t1 to time 6 is a period necessary for theoperation of the row-related circuit for one bank.

The inactive state of signal SCRC changes the operation mode of circuitsincluded in region 202 to the one in which the leakage currentdecreases.

Local bit line equalize signal l.EQ, local word line activation signall.RXT and local sense amplifier activation signal l.SE outputrespectively from level keep circuits 228, 238 and 248 keep respectivelevels.

At time t7, the sense-related switch is set to OFF state and powersupply lines are set into the cutoff state.

At the rising edge of clock signal CLK at time t8, bank signal B7 andsignal Row attain the active state and precharge signal PC also attainsthe active state. Consequently, NOR circuits 222, 232 and 242 is drivenby a signal output from one-shot pulse generation circuit 214 receivingthe level of signal PC input via driver circuit 210, and the levels offlip-flop circuits 224, 234 and 244 are reset.

Signals l.EQ, l.RXT and l.SE are reset according to the active state ofsignal SCRC at time t8. The level kept by latch circuit 250 is alsoreset according to activation of signal SCRC, and accordingly the levelof row predecode line PDL is reset.

In the period from time t6 to time t8, the circuits included in region202 are reset in order to reduce the leakage current. However, thelevels of signal l.EQ, signal l.RXT, signal l.SE and row predecoder linePDL are all kept at their levels respectively.

After a fixed period (period from time t1 to time t6) for taking acommand signal and an address signal for an activated bank, leakagecurrent can be restricted by the hierarchical power supply structureconcerning the circuits included in region 202. Therefore, reduction ofthe leakage current in the standby state as well as reduction of theleakage current in the period in which the bank is in the active stateare possible. Further, it is possible to control the voltage level ofthe power supply lines for each row-related circuit independently.

An operation which is executed when accesses are successively made to aplurality of different banks in the structure of row predecoder 36 shownin FIG. 13 will be described using the timing chart of FIG. 16.

At time t1, in response to the active state of bank address B7 and theactive state of signal Row, the level of signal ACT in the active stateis taken from command data bus 53 b into level hold circuit 208similarly to the operation shown in FIG. 15. Accordingly, the level ofthe flag output from level hold circuit 208 changes to “H” level.

An operation of a bank corresponding to bank address B7 is thereafterperformed as shown in FIG. 15.

Next at time t5, bank address B2 and signal Row are set into the activestate and a row access is made to a bank different from the one selectedat time t1. At this time, signal RDDRV is not activated even if anaccess to another bank is set when the signal has been inactivated afterit was activated once. Therefore, the level of a row predecoder line fora bank which is selected at time t1 maintains its original level.

In this process, the row address-related switch, the word line-relatedswitch, and the sense-related switch are turned on/off at the timingshown in FIG. 15.

Reduction of power consumption in the standby cycle and the active cycleis possible by controlling, for example, the timing of short-circuitrespectively at those sections related to the row address, the word lineselection, and the sense as described above.

Regarding column-related circuits, a column decoder will be described asone example using FIG. 17.

Referring to FIG. 17, from control circuit 20, a read-related accessidentify signal READ for instructing a reading operation, awrite-related access identify signal WRITE for instructing a writingoperation, an auto precharge identify signal ATPC for instructing anauto precharge operation, a burst ending identify signal BEND forinstructing termination of a burst operation for each bank, atermination identify signal TERM for instructing to force termination ofa column select operation when another bank is selected during thecolumn select operation, and a precharge operation identify signal PCCMPfor instructing termination of the precharge operation are transmittedvia command data bus 53 b.

A signal BACT is a flag signal which is kept by level keep circuit 208as a bank is selected.

Column predecoder 34 includes an AND circuit 510 receiving signal Clmtransmitted by command data bus 53 b and bank address signal B7, aone-shot pulse generation circuit 512 outputting a one-shot pulse signalin response to activation of an output from AND circuit 510, an invertercircuit 514 activated in response to activation of flag signal BACT todrive an output from one-shot pulse generation circuit 512, an NORcircuit 516 receiving signals ATPC, BEND and TERM, and a flip-flopcircuit 518 set by an output from inverter circuit 514, reset by anoutput from NOR circuit 516 and indicates that a column-relatedoperation is activated.

Column predecoder 34 further includes an inverter circuit 520 activatedin response to activation of column flag signal ColumnFLAG to drivesignal READ transmitted by command data bus 53 b, an NOR circuit 522receiving signals WRITE, ATPC, BEND and TERM, and a flip-flop circuit524 set by an output from inverter circuit 520, reset by an output fromNOR circuit 522, and outputs read flag signal READFLAG indicating thatreading operation is activated.

Column predecoder 34 further includes an inverter circuit 530 activatedin response to activation of column flag signal ColumnFLAG to drivesignal WRITE transmitted by command data bus 53 b, an NOR circuit 532receiving signals READ, ATPC, BEND and TERM, and a flip-flop circuit 534set by an output from inverter circuit 530, reset by an output from NORcircuit 532, and outputs write flag signal WriteFLAG indicating thatwriting operation is activated.

Column predecoder 34 further includes a shift circuit 542 receivingcolumn flag signal ColumnFLAG to delay it by a prescribed clock period,an OR circuit 544 receiving flag signal BACT and an output from shiftcircuit 542, an inverter circuit 540 activated in response to activationof the output from NOR circuit 544 to drive signal ATPC transmitted bycommand data bus 53 b, an inverter circuit 546 receiving signal PCCMPtransmitted by command data bus 53 b, and a flip-flop circuit 548 set byan output from inverter circuit 540, reset by an output from invertercircuit 546 and outputs auto precharge flag signal ATPCFLAG indicatingthat auto precharge operation is activated.

Column predecoder 34 further includes a latch circuit 550 activatedaccording to an output signal from one-shot pulse generation circuit 512to take a column address signal transmitted by address bus 50 c. Latchcircuit 550 is reset in response to activation of signal SCRC.

Column predecoder 34 further includes an even number bit adjustmentcircuit 552 and an odd number bit adjustment circuit 554 adjusting thelower order bits of address signals corresponding to a column selectionline (not shown) to be activated according to the lower order bits ofcolumn addresses kept by latch circuit 550, a predecoder 556 predecodingdata of the higher order bits from latch circuit 550, a predecoder 557predecoding data of the lower order bits from even number bit adjustmentcircuit 552, a predecoder 558 predecoding data of the lower order bitsfrom odd number bit adjustment circuit 554, a shift circuit 560activated by signal READ or signal WRITE to delay predecode signals frompredecoders 556, 557 and 558 by a prescribed number of docks (e.g. 2clocks) to output them, and a drive circuit 562 activated by signal Missindicating that an address from a redundancy decoder (not shown) doesnot correspond to a defective address, and drives, receiving an outputfrom shift circuit 560, the level of a column predecode line accordingto an output signal from shift circuit 560.

The reading operation of column predecoder 34 shown in FIG. 17 and thestates of the row-related circuits will be described using the timingcharts of FIG. 18 and FIG. 19.

Referring to FIGS. 18 and 19, at time t1, a selected bank is activated,local equalize signal l.EQ is inactivated in response to inactivation ofequalize signal EQ, so that the equalized state of a bit line pair orthe like in the selected bank is canceled. Signals SCRC and SCRC2 attainthe active state.

From time t1, a row address-related switch, a word line-related switch,and a sense-related switch are set into ON state successively to setpower supply lines into the short-circuit state. At a prescribed timing,those switches are set into OFF state to set the power supply lines intothe cutoff state.

At time t2, word line activation signal RXT is activated, an operationof selecting any word line according to a row address signal isperformed. At time t3, local sense amplifier activation signal l.SE isactivated in response to activation of sense amplifier activation signalSE, and data of a plurality of selected memory cells are amplified as acorresponding bit line potential.

At time t4, flag signals ColumnFLAG and READFLAG are activated whensignal READ is activated to designate the reading operation. On theother hand, a column address signal is taken by the selected bank, datain the selected memory cells are read out from the bank to be kept attime t5 and t6. At time t6, signal BEND is activated in response totermination of reading trigger of data corresponding to a burst lengthof 4.

The period from time t1 to t4 corresponds to a period which is necessaryfor the operation of a row-related circuit for one bank.

From time t4, a column address-related switch, a YS gate-related switch,a data-related switch and an output-related switch are successively setinto ON state to set power supply lines into the short-circuit state. Ata prescribed timing, each of the switches is set into OFF state to setpower supply lines into the cutoff state.

According to the rise and fall of clock signal CLK at time t6 and t7,data read from the bank to be kept at time t5 is parallel-serialconverted to be output.

According to the rise and fall of dock signal CLK at time t8 and t9,data read and kept by the bank at the time t6 is parallel-serialconverted to be output.

At time t8, the selected bank is precharged in response to activation ofsignal PC.

At time t10, output of data corresponding to the burst length of 4 iscompleted.

At time t11, signal SCRC enters the inactive state and the operationmode changes to the one operating by the hierarchical power supply toallow a small leakage current.

As heretofore described, reduction of power consumption in the standbycycle and the active cycle is possible by controlling the timing ofshort-circuit of, for example, the column address-related, YSgate-related, data-related, output-related circuits.

(Fifth Embodiment)

A hierarchical power supply system in a semiconductor integrated circuitdevice according to the fifth embodiment of the present invention willbe described using FIG. 20.

Inverters X1, X2 and X3 are representatively shown in FIG. 20 as forminga structure of an internal circuit. Inverters X1, X2 and X3 each includea PMOS transistor P1 and an NMOS transistor N1 and have a structure of aCMOS inverter.

For a main power supply line L1, internal supply voltage-down convertersVDC5 a and VDC5 b generating a fixed potential decreased from the levelof external supply voltage ExtVcc are arranged. For a sub-supply lineL2, an internal supply voltage-down converter VDC5 c generating a fixedpotential reduced from the level of external power supply voltage ExtVccis arranged.

Internal supply voltage-down converter VDC5 a includes a differentialamplifier 5 a and a PMOS transistor P20 a. PMOS transistor P20 a has oneconduction terminal connected to external supply voltage ExtVcc and theother conduction terminal connected to main supply line L1. The gateelectrode of PMOS transistor P20 a receives an output from differentialamplifier 5 a. Differential amplifier 5 a receives at its inputreference voltage (1.5V) and voltage Vcc of main supply line L1.Differential amplifier 5 a operates in response to signal ACT (activecycle).

Internal supply voltage-down converter VDC5 b includes a differentialamplifier 5 b and a PMOS transistor P20 b. PMOS transistor P20 b has oneconduction terminal connected to external supply voltage ExtVcc and theother conduction terminal connected to main supply line L1. The gateelectrode of PMOS transistor P20 b receives an output from differentialamplifier 5 b. Differential amplifier 5 b receives a higher referencevoltage (1.8V) and voltage Vcc of main supply line L1 at its input.Differential amplifier 5 b operates in the standby cycle (in response tosignal stdby).

Internal supply voltage-down converter VDC5 c includes a differentialamplifier 5 c and a PMOS transistor P20 c. One conduction terminal ofPMOS transistor P20 c is connected to external supply voltage ExtVcc,and the other conduction terminal is connected to sub-supply line L2.The gate electrode of PMOS transistor P20 c receives an output fromdifferential amplifier 5 c. Differential amplifier 5 c receivesreference voltage (1.5V) and voltage SubVcc of sub-supply line L2 at itsinput. Differential amplifier 5 c operates in both of the standby cycle(signal stdby) and the active cycle (signal ACT).

Further, instead of the switching transistors, a plurality of internalsupply voltage-down converters VDC6 are arranged between main supplyline L1 and sub-supply line L2 at prescribed intervals (hereinafterreferred to as dispersed voltage-down converters VDC6).

Dispersed voltage-down converters VDC6 each include a differentialamplifier 6 a and a PMOS transistor P21. One conduction terminal of PMOStransistor P21 is connected to external supply voltage ExtVcc and theother conduction terminal thereof is connected to sub-supply line L2.The gate electrode of PMOS transistor P21 receives an output fromdifferential amplifier 6 a. Differential amplifier 6 a receives at itsinput voltage Vcc of main supply line L1 and voltage SubVcc ofsub-supply line L2. Differential amplifier 6 a operates in response tosignal ACT.

In the conventional hierarchical power supply system, voltage SubVcc ofsub-supply line L2 is reduced in the standby cycle. Therefore, recoverytime of voltage is necessary when the cycle transits from the standbycycle to the active cycle.

According to the fifth embodiment, in the standby cycle, voltage Vcc ofmain supply line L1 is boosted to increase the gate voltage in order torestrict the leakage current. Accordingly, the effective voltageimmediately after transition to the active cycle is ensured.

Dispersed voltage-down converter VDC6 is used to restrict decrease ofvoltage of sub-supply line L2 in the active cycle (due to the switchingtransistor). Dispersed voltage-down converter VDC6 uses voltage Vcc ofmain supply line L1 as a reference voltage. Therefore, any power supplyinterconnection used for reference is unnecessary and the degree offreedom of arrangement of dispersed voltage down converters enhanced.

Between a main ground line L3 and a sub-ground line L4, switchingtransistors N0 a, N0 b, . . . electrically connecting main ground lineL3 and sub-ground line L4 in response to hierarchical supply controlsignal SW are dispersed at prescribed intervals. As a result, theimpedance due to power supply and ground potential is reduced. Thehierarchical power supply system according to the fifth embodiment ofthe present invention is hereinafter referred to as DLCC system.

Using FIGS. 21-23, the simulation executed for confirming the operationof DLCC system shown in FIG. 20 is described.

FIG. 21 illustrates a structure for the simulation for making sure ofthe operation of DLCC system in the fifth embodiment.

Referring to FIG. 21, the inverter chain is formed of 100 stages (X1,X2, . . . ). Between inverters, load inverters 135 shown in FIG. 22 areconnected. Load inverters 135 each include a plurality of inverters 136a and 136 b as illustrated in FIG. 22. To each of inverters 136 a and136 b, a plurality of inverters 137 a, 137 b and 137 c are connected.

Total five dispersed voltage-down converters VDC6 are arranged atprescribed intervals. Total five switching transistors N0 a, N0 b, . . .are arranged at prescribed intervals. Switching transistors N0 a . . .that are NMOS transistors are turned on/off by hierarchical power supplycontrol signal SW.

FIG. 23 shows specific conditions for the simulation shown in FIG. 21.

Referring to FIG. 23, suppose that main supply line L1 and main groundline L3 are aluminum interconnections having a width of 10 μm, andsub-supply line L2 and sub-ground line L4 are aluminum interconnectionshaving a width of 5 μm. The length of each line is 1.8 mm.

External supply voltage ExtVcc is set at 2.25V (90% of 2.5V) andinternal supply voltage Vdd is set at 1.35V (90% of 1.5V). The thresholdvalues (Vthp, Vthn), length (Lb, Ln), width (Wp, Wn) of the switchingtransistor, the threshold values (Vthp, Vthn), length (Lp, Ln), width(Wp, Wn) and the like of the inverter are shown in FIG. 23.

Voltage Vcc of main supply line L1 is set at 1.35V in the active cycleand driven to 1.65V in the standby cycle. To the well of the PMOStransistor, voltage variation similar to that applied to voltage Vcc ofmain supply line L1 is applied. Voltage SubVcc of sub-supply line L2 isset at 1.35V.

The results of the simulation for the conventional hierarchical powersupply system and for the DLCC system are compared with each other to beexamined using FIGS. 24-28.

FIG. 24 graphically shows simulation waveforms of the conventionalhierarchical power supply system, and FIG. 25 graphically showssimulation waveforms of DLCC system. In each graph, the ordinaterepresents volt, and the abscissa represents time (ns). In bothsimulation, a signal (Signal) is applied around 19-20 ns. In FIGS. 24and 25, symbol Vcc represents the voltage of main supply line L1, symbolS-Vcc represents the voltage of sub-supply line L2, and the symbol S-GNDrepresents the voltage of sub-ground line L4.

In the conventional hierarchical power supply system, as shown in FIG.24, the voltage of sub-supply line L2 is decreased from 1.35V (voltageof main supply line L1) by about 0.1V. In DLCC system, as shown in FIG.25, the decrease of voltage of sub-supply line L2 is approximately0.02V.

In FIG. 26, the switching transistor is always set in ON state and theinverter speed is compared based on the number of stages of theinverters from the position of the switching transistor. In FIG. 26, thesolid line a and the solid line b respectively correspond to theconventional hierarchical power supply system and DLCC system. For DLCCsystem, the number of inverters from the position of the dispersedvoltage-down converter VDC6 corresponds to the abscissa.

As shown in FIG. 26, in DLCC system, the influence of theinterconnection resistance reduces, and the processing speed isapparently improved irrespective of the number of stages of theinverters.

Concerning the average speed of the inverters formed of 100 stages, inDLCC system, increase of speed is accomplished by 32% compared with thecase in which the threshold value approximately equal to theconventional one is used, and by 20% compared with the conventionalhierarchical power supply system.

FIG. 28 illustrates the delay of the inverter chain under the conditionsshown in FIG. 27. The result of measurement of the delay of the inverterchain occurred upon recovery from change of the voltage of the powersupply line is shown in FIGS. 27 and 28.

Referring to FIG. 27, a signal to be input to the inverter is suppliedto second after the ON timing of the switching transistor. FIG. 28graphically shows the result of measurement of the increase in the delayof the inverter chain at this time. For DLCC system, the voltage of mainsupply line L1 MVcc) is varied as shown in FIG. 27.

The solid line a of FIG. 28 shows the amount of increase in the delay inthe conventional hierarchical power supply system, and the solid line bshows the amount of increase in the delay in DLCC system.

Referring to FIG. 28, in DLCC system, delay is improved by approximately0.05 ns compared with the conventional hierarchical power supply system.If t0 is set to about 1.5 ns, the delay could be avoided.

As heretofore described, according to the fifth embodiment, thehierarchical power supply system (DLCC system) restricts decrease ofvoltage of sub-supply line L2 in the active cycle, and the average speedof the inverter can be improved. Further, it is possible to restrict theinfluence due to the recovery of the operation power supply to avoid thedelay of the inverter chain.

In the structure of the present invention, the potential of thesub-supply line is applied from the external potential in operation onlyon the power supply side. As a result, decrease of the potential on thepower supply side can be reduced. This method is apparently applicableto the power supply line on the ground potential side.

(Sixth Embodiment)

Description of a semiconductor integrated circuit device according tothe sixth embodiment will be given below. The semiconductor integratedcircuit device according to the sixth embodiment allows a test of theleakage current to be conducted for the hierarchical power supplysystem.

Referring to FIG. 29, leakage current test circuits 120 a and 120 baccording to the sixth embodiment are described.

For an internal circuit formed of inverters X1, X2 and X3, a main supplyline L1, a sub-supply line L2, a main ground line L3 and a sub-groundline L4 are arranged. Between main supply line L1 and sub-supply lineL2, a switching transistor P0 is connected. A switching transistor N0 isconnected between main ground line L3 and sub-ground line L4.

Further, between main supply line L1 and sub-supply line L2, adiode-connected NMOS transistor N7 is provided in order to prevent thedifference of the potential level from being increased to exceed a fixedpotential difference. Between main ground line L3 and sub-ground lineL4, a diode-connected PMOS transistor P7 is connected for preventing thepotential difference from being increased to exceed a constant value.

Switching transistor P0 receives hierarchical power supply controlsignal /DLCC at its gate electrode. Switching transistor N0 receiveshierarchical power supply control signal DLCC at its gate electrode.

For main supply line L1, differential amplifiers 3 a, 3 b and 3 c areprovided. For sub-supply line L2, a differential amplifier 3 d isprovided. Differential amplifier 3 a attains the active state inresponse to control signal DLCC. Differential amplifier 3 c attains theactive state in response to act signal ACT.

A differential amplifier 4 is arranged for sub-ground line L4.Differential amplifier 4 attains the active state in response to controlsignal /DLCC.

For differential amplifiers 3 a, 3 b, 3 c and 3 d, leakage current testcircuit 120 a is arranged. For differential amplifier 4, leakage currenttest circuit 120 b is arranged.

Leakage current test circuit 120 a includes a constant current source121 a, resistors R1 and R2, and PMOS transistors P9 a, P9 b, P8 a, P8 b. . . P8 a 1. Between supply potential and ground potential, constantcurrent source 121 a, PMOS transistors P9 a and P8 a . . . P8 h areconnected in series. The gate electrode of PMOS transistor P9 a receivestest signal TESTPH. The gate electrodes of PMOS transistors P8 a . . .P8 h are connected to the ground potential.

Resistor R1, PMOS transistor P9 b and resistor R2 are connected inseries between constant current source 121 a and the connection node ofPMOS transistors P8 a and P8 b. The connection node of resistor R1 andPMOS transistor P9 b is connected to the connection node of PMOStransistors P9 a and P8 a. The gate electrode of PMOS transistor P9 breceives test signal TESTPL.

Leakage current test circuit 120 b includes a constant current source121 b, NMOS transistors N9 a, N9 b, N8 a . . . N8 c and resistors R3 andR4. Between the supply potential and the ground potential, constantcurrent source 121 b, NMOS transistor N9 a, and NMOS transistors P8 a .. . P8 c are connected in series. The gate electrode of NMOS transistorN9 a receives test signal TESTSH. The gate electrodes of NMOStransistors N8 a . . . are connected to the supply potential.

Resistor R3, NMOS transistor N9 b and resistor R4 are connected inseries between constant current source 121 b and the connection node ofNMOS transistors N8 a and N8 b. The connection node of resistor R3 andNMOS transistor N9 b is connected to the connection node of NMOStransistors N9 a and N8 a. The gate electrode of NMOS transistor N9 breceives test signal TESTSL.

The voltage on the output node of constant current source 121 a isreferred to as reference voltage VrefH. The voltage on the connectionnode of NMOS transistors P8 a and P8 b is referred to as VrefL. Thevoltage on the output node of constant current source 121 b is referredto as reference voltage Vref.

Differential amplifier 4 receives at its input reference voltage Vrefand the voltage of sub-ground line L4. Differential amplifier 3 areceives at its input reference voltage VrefH and the voltage of mainsupply line L1. Differential amplifier 3 b receives at its inputreference voltage VrefL and the voltage of main supply line L1.Differential amplifier 3 c receives at its input reference voltage VrefLand the voltage of main supply line L1. Differential amplifier 3 dreceives reference voltage VrefL and voltage of sub-supply line L2 atits input.

The current flowing from constant current source 121 a and the resistorelement produce the reference potential to adjust the potential of mainsupply line L1 and sub-supply line L2. The reference potential isproduced by the current flowing from constant current source 121 b andthe resistor element, and the potential of main ground line L3 andsub-ground line L4 is adjusted.

Leakage current test circuit 120 a is now described. In a normal mode,test signal TESTPH is in the state of L level, and test signal TESTPL isin the state of H level.

In the standby cycle, there is a fixed potential difference generated byPMOS transistor P8 a between reference voltage VrefH and referencevoltage VrefL.

In the test mode, test signal TESTPH is set at H level. Accordingly,PMOS transistor P9 a is set into OFF state. Reference voltage VrefH hasa value higher than reference voltage VrefL by potential generated atresistor R1. Consequently, voltage Vcc of main supply line L1 in thestandby cycle can be set higher than voltage SubVcc of sub-supply lineL2.

When test signal TESTPL is set at L level, PMOS transistor P9 b attainsON state. Accordingly, reference voltage VrefH changes to the voltagehigher than reference voltage VrefL by potential generated at resistorR2.

Voltage Vcc of main supply line L1 in the standby cycle can be set lowerthan voltage SubVcc of sub-supply line L2 compared with the normaloperation by setting reference voltage VrefH lower than the potentialgenerated by the PMOS transistor. Leakage current test becomes possiblesince the leakage current thus increases.

Leakage current test circuit 120 b is next described. In the normalmode, test signal TESTSH is in the state of H level and test signalTESTSL in the state of L level.

In the standby cycle, the voltage level of sub-ground line L4 is sethigher than the ground potential, and accordingly a fixed potentialdifference is generated between reference voltage Vref and groundpotential.

In the test mode, test signal TESTSH is set at L level. NMOS transistorN9 a is accordingly set into OFF state. Reference voltage Vref changesto voltage higher than ground potential by potential generated atresistor R3. As a result, voltage SubVss of sub-ground line L4 in thestandby cycle can be set higher than voltage Vss of main ground line L3.

When test signal TESTSL is set at H level, NMOS transistor N9 b attainsON state. Consequently, reference voltage Vref changes to potentialhigher than ground potential Vss by potential generated by channelresistance of two NMOS transistors and resistor R4.

By setting the reference voltage Vref lower than the one generated byresistors R3 and R4, voltage SubVss of sub-ground line L4 in the standbycycle can be set lower than voltage Vss of main ground line L3 comparedwith the normal operation. As a result, the leakage current increases toallow the leakage current test to be performed.

(Seventh Embodiment)

A semiconductor integrated circuit device according to the seventhembodiment of the present invention will be described below. Thesemiconductor integrated circuit device according to the seventhembodiment makes it possible to externally monitor the leakage currenttest performed for the hierarchical power supply system.

A leakage current test circuit 123 a of the seventh embodiment isdescribed using FIG. 30.

Leakage current test circuit 123 a shown in FIG. 30 includes constantcurrent sources 124 a and 124 b, NMOS transistors N10 a and N10 b, and abuffer 125. NMOS transistor N10 a is diode-connected.

NMOS transistors N10 a and N10 b connected as the current mirror arerespectively connected to a main ground line L3 and a sub-ground lineL4. A switching transistor N0 is connected to main ground line L3 andsub-ground line L4.

Reference current flows from constant current source 124 a into NMOStransistor N10 a. Reference current also flows from constant currentsource 124 b into NMOS transistor N10 b.

Buffer 125 is arranged at the connection node of constant current source124 b and NMOS transistor N10 b. The output node of buffer 125 isconnected to an external terminal.

If voltage Vss of main ground line L3 and voltage SubVss of sub-groundline L4 have the same level, negative bias is never applied torespective gate electrodes of NMOS transistors N10 a and N10 b. In thiscase, the amount of reference current flowing into the transistors isalmost balanced.

If the leakage current decreases, voltage SubVss of sub-ground line L4is higher relative to voltage Vss of main ground line L3. In this case,the amount of reference current flowing into NMOS transistor N10 bconnected to sub-ground line L4 is lower relative to the amount ofreference current flowing into NMOS transistor N10 a connected to mainground line L3. (The ratio of the amount of the reference currentcorresponds to the ratio of decrease of the leakage current.)

The current of constant current source 124 b is accumulated at buffer125. When the accumulated current exceeds a logical threshold value ofbuffer 125, a logical value is generated. The logical threshold valuecan be monitored at the external terminal.

Another leakage current test circuit 123 b according to the seventhembodiment is described using FIG. 31.

In the leakage current test circuit 123 b shown in FIG. 31, a PMOStransistor P10 a is provided instead of constant current source 124 ashown in FIG. 30, and a PMOS transistor P10 b is provided instead ofconstant current source 124 b. One conduction terminal of an NMOStransistor N11 is connected to an external pad. One conduction terminalof each of PMOS transistors P10 a and P10 b is connected to supplypotential.

The gate electrodes of PMOS transistors P10 a and P10 b are connected tothe other conduction terminal of NMOS transistor N11. Receiving enablesignal EN for test, NMOS transistor N11 attains ON state to allow thepotential of the external pad to be supplied to the gate electrodes ofPMOS transistors P10 a and P10 b. As a result, the amount of referencecurrent flowing externally into NMOS transistors N10 a and N10 b can bechanged externally.

Using FIG. 32, still another leakage current test circuit 123 caccording to the seventh embodiment is described.

In leakage current test circuit 123 c shown in FIG. 32, PMOS transistorP12 connected as the current mirror is provided between one conductionterminal of an NMOS transistor N11 and gate electrodes of PMOStransistors P10 a and P10 b. Receiving any input from the outside,current is generated at PMOS transistors P12 and P10 a.

Configured in this manner, this embodiment allows the leakage current tobe monitored externally.

(Eighth Embodiment)

A semiconductor integrated circuit device according to the eighthembodiment of the present invention is next described. In thesemiconductor integrated circuit device of the eighth embodiment, thetransition of the leakage current due to the switching transistor of thehierarchical power supply system is monitored to be changed.

A leakage current test circuit 126 according to the eighth embodimentwill be described using FIG. 33. Those components similar to those ofleakage current test circuit 123 a have the same reference charactersand description thereof is omitted.

Leakage current test circuit 126 shown in FIG. 33 includes an NMOStransistor N12 a and an NMOS transistor N12 b. The size of the NMOStransistor N12 b is n (>0) times larger than that of diode-connectedNMOS transistor N12 a. NMOS transistors N12 a and N12 b connected as thecurrent mirror respectively receive reference current supplied fromconstant current sources 124 a and 124 b.

One conduction terminal of NMOS transistor N12 a receives groundpotential Vss. An NMOS transistor N13 is arranged between one conductionterminal of NMOS transistor N12 b and ground potential Vss.

A buffer 125 is connected to the connection node of constant currentsource 124 b and one conduction terminal of NMOS transistor N12 b. Theoutput node of buffer 125 is connected to a negative voltage pump 127.The output from negative voltage pump 127 is connected to the gateelectrode of NMOS transistor N13.

The gate electrode of a switching transistor N0 that short-circuits asub-ground line L4 and a main ground line L3 is connected to supplypotential by a switch S/W in the active cycle. In the standby cycle, thegate electrode is connected to the gate electrode of NMOS transistorN13.

NMOS transistor N13 is a dummy transistor for switching transistor N0. Aloop circuit is formed by NMOS transistor N12 b, buffer 125, negativevoltage pump 127, and NMOS transistor N13.

When an amount of reference current (leakage current) flowing into NMOStransistor N12 b increases, negative voltage pump 127 outputs negativevoltage. NMOS transistor N13 enters OFF state.

When an amount of reference current flowing into NMOS transistor N12 bdecreases, the operation of negative voltage pump 127 is stopped.Accordingly, NMOS transistor N13 attains ON state.

The amount of current flowing respectively to NMOS transistors N12 a andN12 b is equal to each other. However, since the ratio of the transistorsize is 1:n, the actual ratio of decrease of the leakage current is 1/nrelative to a logical value which is an output from buffer 125.Potential supplied to the gate electrode of NMOS transistor N13 isgenerated at negative voltage pump 127 in order to keep this state.

In the active cycle, switch S/W is connected to supply potential.Accordingly, switching transistor N0 attains ON state, and main groundline L3 and sub-ground line 14 are short-circuited.

In the standby cycle, the leakage current flowing through the switchingtransistor is reduced according to the level of the negative voltageoutput from negative voltage pump 127.

(Ninth Embodiment)

A semiconductor integrated circuit device according to the ninthembodiment of the invention is described. In the semiconductorintegrated circuit device according to the ninth embodiment of theinvention, the leakage current in the standby cycle is reduced byapplying negative bias to a switching transistor in a hierarchical powersupply system.

A structure of the hierarchical power supply system according to theninth embodiment of the invention is hereinafter described using FIGS.34 and 35. FIGS. 34 and 35 illustrate inverters X1, X2 . . .representatively as components of an internal circuit. Inverters X1 . .. each include a PMOS transistor P1 and an NMOS transistor N1 and thushave a configuration of a CMOS inverter. Transistors constitutinginverters X1 . . . have a low threshold.

Referring to FIG. 34, switching transistors P0 a, P0 b . . . arearranged with a prescribed spacing therebetween, between a main powersupply line L1 and a sub-power supply line L2. Between a main groundline L3 and a sub-ground line L4, switching transistors N0 a, N0 b . . .are arranged with a prescribed spacing therebetween.

A switch control circuit 620 is arranged for switch transistors P0 a, P0b . . . A switch control circuit 600 is arranged for switch transistorsN0 a, N0 b . . . Switch control circuits 600 and 620 control the gatevoltage of corresponding switching transistors in response to ahierarchical power supply control signal SCRCF.

Switch control circuit 600 shown in FIG. 35 controls the gate voltagewith three values. Specifically, switch control circuit 600 applies anyof external power supply voltage ExtVcc, voltage Vss, and substratevoltage VBB at a prescribed timing to switching transistors N0 a, . . .Voltage Vss may be any of the voltage of main ground line L3, internallygenerated low power supply voltage, and external ground voltage.

Switch control circuit 620 illustrated in FIG. 35 controls the gatevoltage with three values. Specifically, switch control circuit 620applies any of voltage Vss, voltage Mvcc, and external power supplyvoltage ExtVcc at a prescribed timing to switching transistors P0 a, . .. Voltage MVcc may be any of the voltage of main power supply line L1and internally generated power supply voltage.

The substrates of switching transistors (P0 a, P0 b . . . ) thatshort-circuit main power supply line L1 and sub-power supply line L2 areconnected to main power supply line L1. The substrates of switchingtransistors (N0 a, N0 b . . . ) that short-circuit main ground line L3and sub-ground line L4 are connected to main ground line L3.

One example of a structure of switch control circuit 600 illustrated inFIGS. 34 and 35 is specifically described using FIG. 36. Switch controlcircuit 600 shown in FIG. 36 includes an inverter 601, level conversionbuffers 602, 603 and 604, a one-shot pulse generation circuit 605, anNOR circuit 609, a PMOS transistor P15, and NMOS transistors N15 andN16.

Inverter 601 inverts hierarchical power supply control signal SCRCF.Level conversion buffer 602 is connected between an output node ofinverter 601 and a node SA1. Level conversion buffer 602 converts anoutput level of inverter 601 using external power supply voltage ExtVccas an operation power supply. One conductive terminal of PMOS transistorP15 is connected to a node SX1, and the other conductive terminalreceives external power supply voltage ExtVcc. The gate electrode ofPMOS transistor P15 is connected to node SA1.

One-shot pulse generation circuit 605 outputs a one-shot pulse signal inresponse to an output from inverter 601. One-shot pulse generationcircuit 605 includes inverters 606.1, 606.2, 606.3, 606.4, 606.5, 606.6and 606.7, an NAND circuit 607, and an inverter 608. Inverters 606.1 . .. , 606.7 are connected in series. Inverter 606.1 receives an outputfrom inverter 601. NAND circuit 607 receives outputs from inverter 601and inverter 606.7. Inverter 608 inverts an output from NAND circuit607.

Level conversion buffer 603 is connected between an output node ofinverter 608 and a node SB1. Level conversion buffer 603 converts anoutput level of inverter 608 using substrate voltage VBB as theoperation power supply. One conductive terminal of NMOS transistor N15is connected to node SX1, and the other conductive terminal receivesvoltage Vss. The gate electrode of NMOS transistor N15 is connected tonode SB1, and the substrate receives substrate voltage VBB.

NOR circuit 609 receives outputs from inverters 608 and 601. Levelconversion buffer 604 is connected between an output node of NOR circuit609 and a node SC1. Level conversion buffer 604 converts an output levelof NOR circuit 609 using substrate voltage VBB as the operation powersupply. One conductive terminal of NMOS transistor N16 is connected tonode SX1, and the other conductive terminal receives substrate voltageVBB. The gate electrode of NMOS transistor N16 is connected to node SC1,and the substrate receives substrate voltage VBB. Node SX1 is connectedto the gate electrode of a switching transistor (N0) coupling mainground line L3 with sub-ground line L4.

An operation of switch control circuit 600 illustrated in FIG. 36 isdescribed using the timing chart of FIG. 37. The reference characterintVcc in the chart represents an internal power supply voltage of achip.

Referring to FIG. 37, an active cycle starts at time t0 whenhierarchical power supply control signal SCRCF rises from L level to Hlevel. Accordingly, node SA1 falls from H level (at least intVcc) to Llevel (Vss). Node SB1 maintains L level (Vss or less). Node SC1 fallsfrom H level to L level (Vss or less). Node SX1 rises from L level (Vssor less) to H level (external power supply voltage ExtVcc). As a result,switching transistor N0 is rendered conductive.

At time t1, hierarchical power supply control signal SCRCF falls to Llevel to change the active cycle to a standby cycle. Accordingly, nodeSA1 rises from L level to H level. A one-shot pulse signal is generatedat one-shot pulse generation circuit 605. According to the one-shotpulse signal, node SB1 rises to H level at time t1, and falls to L levelat time t2. According to the one-shot pulse signal, node SC1 rises fromL level to H level at time t2.

Node SX1 falls from H level to Vss level at time t1, and further fallsto a lower voltage level at time t2.

The leakage current in the standby cycle can thus be decreased byapplying negative bias to the gate electrode of switching transistor N0in the standby cycle.

One example of the structure of switch control circuit 620 according tothe ninth embodiment of the invention is specifically described usingFIG. 38. Switch control circuit 620 illustrated in FIG. 38 includesinverters 621 and 628, level conversion buffers 622, 623 and 624, an NORcircuit 629, a one-shot pulse generation circuit 625, an NMOS transistorN17 and PMOS transistors P16 and P17.

Inverter 621 inverts hierarchical power supply control signal SCRCF.Inverter 628 inverts an output of inverter 621. Level conversion buffer622 is connected between an output node of inverter 628 and a node SA2.Level conversion buffer 622 converts an output level of inverter 628using external power supply voltage ExtVcc as the operation powersupply. One conductive terminal of NMOS transistor N17 is connected to anode SX2, and the other conductive terminal receives voltage Vss. Thegate electrode of NMOS transistor N17 is connected to node SA2.

One-shot pulse generation circuit 625 outputs a one-shot pulse signal inresponse to an output from inverter 621. One-shot pulse generationcircuit 625 includes inverters 626.1, 626.2, 626.3, 626.4, 626.5, 626.6and 626.7, and an NAND circuit 627. Inverters 626.1, . . . , 626.7 areconnected in series. Inverter 626.1 receives an output from inverter621. NAND circuit 627 receives an output from inverter 621 and an outputfrom inverter 626.7.

Level conversion buffer 623 is connected between an output node of NANDcircuit 627 and a node SB2. Level conversion buffer 623 converts anoutput level of NAND circuit 627 using external power supply voltageExtVcc as the operation power supply. One conductive terminal of PMOStransistor P16 is connected to node SX2, and the other conductiveterminal receives voltage MVcc. The gate electrode of PMOS transistorP16 is connected to node SB2, and its substrate receives external powersupply voltage ExtVcc.

NOR circuit 629 receives outputs from inverter 621 and NAND circuit 627.Level conversion buffer 624 is connected between an output node of NORcircuit 629 and a node SC2. Level conversion buffer 624 converts anoutput level of NOR circuit 629 using external power supply voltageExtVcc as the operation power supply. One conductive terminal of PMOStransistor P17 is connected to node SX2, and the other conductiveterminal receives external power supply voltage ExtVcc. The gateelectrode of PMOS transistor P17 is connected to node SC2, and itssubstrate receives external power supply voltage ExtVcc. Node SX2 isconnected to the gate electrode of a switching transistor (P0)connecting main power supply line L1 with sub-power supply line L2.

An operation of switch control circuit 620 illustrated in FIG. 38 ishereinafter described using the timing chart of FIG. 39.

Referring to FIG. 39, the standby cycle changes to the active cycle attime t0 when hierarchical power supply control signal SCRCF rises from Llevel to H level. Node SA2 rises from L level (Vss) to H level (externalpower supply voltage ExtVcc). Node SB2 maintains H level (external powersupply voltage ExtVcc). Node SC2 rises from L level (Vss) to H level(external power supply voltage ExtVcc). Node SX2 falls from H level(external power supply voltage ExtVcc) to L level (Vss).

At time t1, the active cycle changes to the standby cycle whenhierarchical power supply control signal SCRCF falls to L level. NodeSA2 falls from H level to L level. A one-shot pulse signal is generatedat one-shot pulse generation circuit 625. According to the one-shotpulse signal, node SB2 falls to L level at time t1, and rises to H levelat time t2. According to the one-shot pulse signal, node SC2 falls to Llevel at time t2.

At time t1, node SX2 rises from L level to an intermediate voltagelevel, and further rises to a higher voltage level at time t2.

The leakage current in the standby cycle can thus be reduced by applyingnegative bias to the gate electrode of switching transistor P0 in thestandby cycle.

In the transition from the active cycle to the standby cycle, switchcontrol circuits 600 and 620 change the voltage applied to the gateelectrode stepwise. If external power supply voltage ExtVcc is directlyapplied to switching transistor P0 and substrate voltage VBB is directlyapplied to switching transistor N0 in the transition from the activecycle to the standby cycle (control with two values), the substratevoltage is raised in the charging and discharging of the gate electrode,and the operable range of the memory cell deteriorates.

According to the ninth embodiment of the invention, the voltage ischanged stepwise and applied to enable reduce the degree of the raise ofthe substrate voltage observed when the gate electrode is charged ordischarged of the switching transistor, to expand the operable range ofthe chip.

Although a structure for controlling ON/OFF of the switching transistorwith three different voltages is described, the switching transistor canbe controlled with four steps of different voltages. For example,instead of external power supply voltage ExtVcc, voltage Vss andsubstrate voltage VBB, boosted power supply voltage VPP, external powersupply voltage ExtVcc, voltage Vss and substrate voltage VBB can be usedto control switching transistor N0 in order to reduce the impedance ofthe switching transistor in the active cycle.

Another structure of the hierarchical power supply system according tothe ninth embodiment is described using FIG. 40. Referring to FIG. 40,in addition to switch control circuits 600 and 620, internal powersupply voltage-down converters VDC3 a, VDC3 b and VDC3 c may be arrangedfor main power supply line L1, and an internal power supply voltage-downconverter may be arranged for sub-power supply line L2.

As described in conjunction with the second embodiment, internal powersupply voltage-down converter VDC3 a reduces the leakage current in theinternal circuit. Internal power supply voltage-down converter VDC3 aoperates in response to a signal DLCC. Internal power supply-voltage-down converter VDC3 b sets the voltage of main power supplyline L1 at a prescribed level (1.5V) in the standby cycle. Internalpower supply voltage-down converter VDC3 c is activated when the chipbecomes active and supplies a relatively high current required foroperation of the chip. Internal power supply voltage-down converter VDC3d sets the voltage of sub-power supply line L2 at a prescribed level(1.5V) in response to activation of internal power supply voltage-downconverter VDC3 a. Signal DLCC is a control signal for controlling thecircuit operation and may be the same as hierarchical power supplycontrol signal SCRCF.

Combination of switch control circuits 600 and 620 and internal powersupply voltage-down converters VDC3 a, VDC3 b, VDC3 c and VDC3 d thusreduces the leakage current in the standby cycle and enables ahigh-speed and high-precision operation to be secured.

(Tenth Embodiment)

A semiconductor integrated circuit device according to the tenthembodiment of the invention is described. In the semiconductorintegrated circuit device according to the tenth embodiment, drop inpower supply that occurs with the circuit operation is decreased bydispersing power supply line capacitors.

When the circuits described above are combined to constitute afunctional block illustrated in FIG. 41, the layout including the mainpower supply line and the sub-power supply line becomes important. InFIG. 41, the functional block is constituted of a PMOS region 701connected to Vcc 703, and an NMOS region 702 connected to Vss 704.

In order to simplify the description, the layout described belowillustrates inverters connected in series with different sizes.

The overall structure of this hierarchical power supply system isdescribed using FIGS. 42 and 43. Referring to FIGS. 42 and 43, invertersX1, X2, X3, X4, . . . forming an internal circuit are provided.Inverters X1 . . . each include a PMOS transistor P1 and an NMOStransistor N1 to form a structure of a CMOS inverter.

A conductive layer 721 d to which sub-Vcc potential is applied and aconductive layer 721 f to which sub-Vss potential is applied arearranged such that they are located on both sides of a region whereinverters X1 . . . are formed. On the outside of conductive layer 721 d,a conductive layer 721 c to which main Vcc potential is applied isarranged, and a conductive layer 721 e to which main Vss potential isapplied is arranged on the outside of conductive layer 721 f.

Conductive layer 721 d to which sub-Vcc is applied is electricallyconnected to source regions 728 a of respective PMOS transistors P1, P3. . . and conductive layer 721 f to which sub-Vss is applied iselectrically connected to source regions 719 a of respective NMOStransistors N2, N4 . . . Conductive layer 721 c receiving main Vcc iselectrically connected to source regions 718 a of respective PMOStransistors P2, P4 . . . , and conductive layer 721 e receiving main Vssis electrically connected to source regions 719 a of respective NMOStransistors N1, N3 . . .

Respective drain regions 718 a of PMOS transistors P1, P3 . . . areelectrically connected to drain regions 719 a of respective NMOStransistors N1, N3 . . . Drain regions 718 a of respective PMOStransistors P2, P4, . . . are electrically connected to drain regions719 a of respective NMOS transistors N2, N4, . . .

Drain regions 718 a and 719 a of both PMOS transistor Pn (n is a naturalnumber) and an NMOS transistor Nn are electrically connected to gateelectrodes 717 a of respective PMOS transistor Pn+1 and NMOS transistorNn+1.

It should be especially noted that a dummy gate 717 b fixed at sub-Vssand a dummy gate 717 c fixed at sub-Vcc are provided, and conductivelayers 721 c, 721 b, 721 e and 721 f are respectively connectedelectrically to P-type layers 718 b and 718 c or N-type layers 719 b and719 c formed at the surface of the substrate.

Such dummies are effective for enhancing stability of processing toshape layers used for transistors or other elements. If the dummies arenot used, the relation of distance between the shaped elements is notuniform and the finished elements have increased or decreaseddimensions, resulting in unstable shapes. In particular, if the finishedgate length is not uniform, gate delay cannot be controlled and anerroneous operation could be caused. The dummies can stabilize theshapes of finished elements by providing a relatively constant distancebetween respective elements. The dummies are further effective forpreventing non-uniformly finished flat portion on the chip in theplanalizing step by CMP (Chemical Mechanical Polishing) often used inrecent years. The CMP process may be applied to formation of variouslayers. Therefore, the dummies could be arranged at various layers. Anactive region and the gate are herein used for convenience ofdescription. However, the dummies may be arranged at other layers.

This layout is described in detail with a method of manufacturingthereof in conjunction with respective layers.

Referring to FIGS. 44 and 52, a semiconductor substrate is formed byarranging an N-type well 713 and a P-type well 714 adjacent to eachother via an N-type bottom layer 712 on a P-type substrate region 711.Trench isolation is formed by burying an insulating layer 715 in atrench, and accordingly active regions are electrically separated fromeach other.

Referring to FIGS. 45 and 53, gate electrode layer 717 a, dummy gates717 b and 717 c are formed from the same layer via an insulating layer(eg. silicon oxide film) on the substrate such that they are separatedfrom each other. Ion implantation using gate electrode layer 717 a orthe like as a mask forms a pair of P-type source/drain regions 718 a inan active region of a PMOS transistor portion. In an active region of anNMOS transistor portion, a pair of N-type source/drain regions 719 a isformed. PMOS transistors P1 . . . and NMOS transistors N1 . . . are thusformed.

Referring to FIGS. 46 and 54, ion implantation using dummy gate layer717 b or the like as a mask forms P-type layers 718 b and 718 c, and ionimplantation using dummy gate layer 717 c or the like as a mask formsN-type layers 719 b and 719 c.

In a small rectangular region 719 d shown at the middle of the lowersection of FIG. 46, N-type active region 719 d for fixing the wellpotential to N-type well 713 is formed and a P-type active region 718 dfor fixing the well potential to P-type well 714 is formed in the smallrectangular region 718 d.

Referring to FIGS. 47 and 55, an interlayer insulating layer 720 formedof a silicon oxide film, for example, is formed to cover the entiresurface of the substrate. A plurality of contact holes 720 a at whichsource/drain regions 718 a and 719 a, P-type layers 718 b and 718 c,N-type layers 719 b and 719 c, and gate electrode layer 717 a are formedat interlayer insulating layer 720. The plurality of contact holes 720 aare each filled with conductive layer 720 b.

Referring to FIGS. 48 and 56, after a conductive layer is formed on theentire surface of interlayer insulating layer 720, the normalphotolithography and etching are applied for patterning. As a result,conductive layers 721 a, 721 b, 721 c, 721 d, 721 e and 721 f are formedthat are separated from each other.

Conductive layer 721 d is electrically connected to source regions 721aof PMOS transistors P1, P3, . . . and P-type layer 718 c. Conductivelayer 721 f is electrically connected to source regions 719 a of NMOStransistors N2, N4, . . . and N-type layer 719 c. Conductive layer 721 cis electrically connected to P-type layer 718 b, and conductive layer721 e is electrically connected to N-type layer 719 b.

Conductive layer 721 a electrically connects the PMOS transistor and theNMOS transistor in one inverter. Conductive layer 721 b is electricallyconnected to each gate electrode layer 717 a.

Referring to FIGS. 49 and 57, an interlayer insulating layer 722 formedof, for example, a silicon oxide film is formed to cover conductivelayers 721 a, 721 b, 721 c, 721 d, 721 e and 721 f. A plurality ofcontact holes 722 a that reach surfaces of respective conductive layers721 a, 721 b, 721 c and 721 e are formed at interlayer insulating layer722. Conductive layer 722 b fills a plurality of contact holes 722 a.

Referring to FIGS. 50 and 58, a conductive layer 723 is formed on theentire surface of interlayer insulating layer 722, and the normalphotolithography and etching are applied for patterning. The patternedconductive layer 723 allows conductive layers 721 a and 721 eelectrically connected to source regions of NMOS transistors N1, N3, . .. to be electrically connected, gate electrode layers 717 a of the PMOSand NMOS transistors in the one inverter to be electrically connected,and conductive layers 721 b and 721 c electrically connected to sourceregions of PMOS transistors P2, P4 . . . to be electrically connected.

Referring to FIGS. 51 and 59, an interlayer insulating layer 724 formedof, for example, a silicon oxide film is formed to cover conductivelayer 723. A plurality of contact holes 724 a reaching the surface ofconductive layer 723 are formed at interlayer insulating layer 724, andconductive layer 724 b fills the plurality of contact holes 724 a.

Referring to FIGS. 42 and 43, a conductive layer 725 is formed on theentire surface of interlayer insulating layer 724, and patterned by thenormal photolithography and etching. As a result, conductive layer 725electrically connected to source regions of PMOS transistors P2, P4, . .. , conductive layer 725 electrically connected to source regions ofNMOS transistors N1, N3, . . . , and conductive layer 725 electricallyconnecting gate electrode layers 717 a of PMOS transistor Pn and Nmostransistor Nn, and drain regions of PMOS transistor Pn+1 and NMOStransistor Nn+1 are formed.

The layout of the hierarchical power supply system of this embodiment isaccordingly completed.

The layout of a basic cell is next described using FIGS. 60-63.

An inverter is formed of two transistors that are a PMOS transistor andan NMOS transistor, and two transistors Pn and Nn shown in FIG. 60 arearranged to form the inverter.

Both of the NAND circuit and the NOR circuit can be constituted of fourtransistors that are two PMOS transistors and two NAND transistors. Asshown in FIG. 61, four transistors Pn, Pn+1, Nn, Nn+1 are arranged.

Those components of FIGS. 60 and 61 that are identical to orcorresponding to components illustrated in FIGS. 42-59 have the samereference characters as those of the components of FIGS. 42-59.

Referring to FIGS. 62 and 63, well-fixed cells are arranged withappropriate spaces in the inverters shown in FIGS. 42-59. In thewell-fixed cell, P-type well 714 is fixed at Vss potential byelectrically connecting it to conductive layers 721 h, 723, 721 e andthe like. N-type well region 713 is fixed at Vcc potential byelectrically connecting it to conductive layers 721 g, 723, 721 c andthe like.

N-type bottom layer 712 is partially removed to allow P-type well 714 tobe indirect contact with P-type substrate region 711. The potential ofP-type substrate region 711 is also fixed at Vss potential. It is notedthat those of the components illustrated in FIGS. 62 and 63 that areidentical or corresponding to those illustrated in FIGS. 42-59 have thesame reference characters as those of the components in FIGS. 42-59.

The relation between the structure of FIGS. 42 and 43 and the structureof FIG. 64 is described below.

Referring to FIGS. 42, 43 and 64, a capacitor 751 ais formed betweendummy gate 717 b and conductive layer 721 c, and a capacitor 751 b isformed between dummy gate 717 b and conductive layer 721 d. A capacitor751 c is formed between dummy gate 717 c and conductive layer 721 e, anda capacitor 751 d is formed between dummy gate 717 c and conductivelayer 721 f.

An MOS capacitor 752 a is formed by a parasitic MOS transistorconstituted of N-type layer 719 c, N-type source/drain region 719 a anddummy gate 717 c. An MOS capacitor 752 b is formed by a parasitic MOStransistor constituted of N-type layers 719 b and 719 c, and dummy gate717 c. An MOS capacitor 752 c is formed by a parasitic MOS transistorconstituted of P-type layer 718 c, P-type source/drain region 718 a anddummy gate 721 d. An MOS capacitor 752 d is formed by a parasitic MOStransistor constituted of P-type layers 718 b and 718 c, and dummy gate717 b.

A diode 753 a is formed since N-type well 713 has main Vcc when P-typesource region 718 a of the PMOS transistor has sub-Vcc. A diode 753 b isformed since P-type well 714 has main Vss when N-type source region 719a of the NMOS transistor has sub-Vss. A diode 753 c is formed betweenP-type layer 718 b and N-type well 713. A diode 753 d is formed betweenN-type layer 719 b and P-type well 714. Diode 753 e is formed betweenN-type well 713 and P-type well 714. A diode 753 f is formed betweenN-type bottom region 712 and P-type substrate region 711.

Resistors 754 a-754 e represent contact resistors.

As clearly seen by FIG. 64, main Vss is supplied to P-type substrateregion 711, P-type well 714 and N-type layer 719 b, and sub-Vss issupplied to N-type source region 719 a and N-type layer 719 c in FIG.43. Main Vcc is supplied to N-type bottom layer 712, N-type well 713 andP-type layer 718 b, and sub-Vcc is supplied to P-type source region 718a and P-type layer 718 c.

According to this embodiment, conductive layer 721 c receiving main Vcc,conductive layer 721 d receiving sub-Vcc, conductive layer 721 ereceiving main Vss, and conductive layer 721 f receiving sub-Vss arerespectively connected to P-type layers 718 b and 718 c, and N-typelayers 719 b and 719 c electrically (see FIG. 48). Conductive layer 721c receiving main Vcc is electrically connected to N-type well 713, andconductive layer 721 e receiving main Vss is electrically connected toP-type well 714 (see FIG. 62).

Accordingly, a number of junction capacitances (capacitances at diodes753 a-753 f) are formed between power supply lines L1 and L2 and groundlines L3 and L4 as illustrated in FIG. 64, and decoupling capacitors ofrespective power supply lines are thus formed. A plurality of capacitorsof the power supply lines thus dist1ibuted enables the power supply dropgenerated with circuit operation to be reduced.

According to this embodiment, a plurality of gate capacitors 751 a-751d, 752 a-752 d are formed between power supply lines L1, L2 and groundlines L3, L4 as illustrated in FIG. 64 to constitute decouplingcapacitors of respective power supply lines. A plurality of capacitorsof power supply lines thus distributed enables the power supply dropgenerated with the circuit operation to be reduced.

The main power supply line, together with the sub-power supply line,forms the junction capacitance. The main power supply and the sub-powersupply function as a decoupling capacitor since the components ofinterconnection resistance of main and sub-power supply lines aredifferent from each other and accordingly the phases relative to thenoise are different. When the capacitor is formed by the same potential,the maximum capacitance is obtained.

According to this embodiment, the relation of the junction capacitancemay be the one between Vss and Vcc.

(1) The necessity of dummy active layers (P-type layers 718 b, 718 c,N-type layers 719 b, 719 c), (2) the necessity of dummy gates 717 b and717 c, and (3) N-type bottom layer 712 in this embodiment arehereinafter described in detail.

(1) Necessity of dummy active layer

The trench isolation is formed by forming a deep trench on the substrateand burying an insulating film in the trench. When the insulating filmis to be buried, the film is deposited on the entire surface of thesubstrate and cut in the CMP (Chemical Mechanical Polishing) processaccording to the height of the trench from the upper surface such thatthe film remains only in the trench portion. In this process, anyportion other than the active region is recognized as the trench.Therefore, if there is no active region except for the active region ofthe transistor, a large trench exists in the region without thetransistor. In this case, if the insulating film deposited at theportion of this trench is cut by the CMP, a relatively large portion iscut compared with the normal trench portion, so that the thickness ofthe insulating film becomes smaller and the isolation characteristic ofthe trench deteriorates. The trench is desirably divided with anappropriate space or less, and desirably the trench isolation regiondoes not continue with a dimension of 100 μm or more. The dummy activelayer is accordingly necessary.

Reference is made here to the circuit portion of the hierarchical powersupply. However, considering the entire chip, the dummy active layer isarranged at any portion other than the circuit portion.

(2) Necessity of dummy gate

As the gate is further miniaturized, the characteristic of exposurecauses diffraction of light, and the finished gate has differentdimensions (width, length) depending on a variety of layouts such as thearrangement (two dimensional) of gate interconnection lines, bendingportion, constricted portion, and the like. If the gate of transistorsare finished with different gate lengths and gate widths, theperformance of the transistors becomes different, leading toinconsistency with the result of simulation.

In order to uniformly finish the gate of the transistor, gates adjacentto each other appropriately are arranged. For example, preferably thereis no space of 3 μm or more from the gate of the transistor. In order toaccomplish this, the dummy gate is necessary.

In FIG. 42, the gates of the transistors are surrounded by the dummygates. Considering the entire chip, there is a number of regions wherethe dummy gates cannot be arranged (such as redundancy programmingregion of laser blow). However, if the transistor region is surroundedby the dummy gate, a buffering region is produced and the stability ofthe finished gate of the transistor improves. Of course if the number ofdummy gate region is doubled or tripled, the stability further improves.

(3) N-type bottom layer 712

N-type bottom layer 712 extends not only below N-type well 713 but belowP-type well 714. Under N-type well 713, a junction capacitance relativeto P-type substrate region 711 is provided. The junction capacitance perunit area can be increased by burying N-type bottom layer 712 having ahigher concentration.

It is not necessary to separate P-type well 714 from P-type substrateregion 712 by N-type bottom layer 712 since they have the samepotential. If N-type bottom layer 712 is intentionally arranged, ajunction capacitance is formed between N-type bottom layer 712 andP-type region (P-type substrate region 711 and P-type well 714).

In order to reduce the resistance of N-type bottom layer 712 to make itfunction as a capacitor of the power supply, shunts are providedrelative to the power supply line at several points. Further, in orderto decrease resistance between P-type well 714 and P-type substrateregion 711, portions where no N-type bottom layer 712 is present areprovided at several portions to shunt P-type well 714 and P-typesubstrate region 711.

In an array of a DRAM (Dynamic Random Access Memory) illustrated in FIG.65, the structure identical to that of FIGS. 42 and 43 is employed at acrossing point of a sense amplifier band and a word driver band toincrease the decoupling capacitor. Accordingly, the power supply dropcan be reduced even if a large amount of current is consumed in thesense operation.

The array of the typical DRAM is described below.

Referring to FIG. 65, a memory cell array is finely divided into memorycell array units surrounded by the sense amplifier band and the worddriver band.

A main word line MWL is arranged across memory cell array units andactivates a sub-word driver SWD which should be activated. In responseto activation of sub-word driver SWD, a corresponding sub-word line SWLis activated. Sense amplifiers are alternately arranged with the memorycell array units therebetween. A sense amplifier located in a regionwhere a selected line of a region (bank) to be activated and a senseselection line are crossed is activated.

A segment YS line is arranged to cross the sense amplifier band in theword line direction of the memory cell array units.

In order to read data from the memory cell array units, segment YS isactivated and the region where segment YS and the bank selection line ofthe region to be activated crosses is activated. A piece of data perfour sense amplifiers is read from the activated region (bank).

The read data are transmitted to a read/write amplifier (hereinafterreferred to as R/W amplifier) through a data line pair running in adirection orthogonal to the word line on the memory cell array. The dataare transmitted to a data output portion over peripheral circuitry via adata bus region. If memory and logic are mixed on the chip, the data aretransmitted to the logic portion via the data bus region.

One example of the layout at the crossing point of FIG. 65 isillustrated in FIG. 66.

Referring to FIG. 66, in the example of the layout at the crossingpoint, dummy active layers 718 c and 719 c and dummy gates 717 b and 717c are formed to surround an inverter formation region and a well-fixedcell formation region.

The portion other than that described above is nearly identical to thestructures of FIGS. 42, 43, 62 and 63, and the same component have thesame reference character and description thereof is omitted.

In the structure illustrated in FIG. 66, N-type bottom layer 712 ispartially removed in the well-fixed cell portion, and P-type well 714and P-type substrate region 711 are directly connected. The decouplingcapacitor becomes more effective by fixing the potential from P-typesubstrate region 711.

Although description is given by using the capacitor related to thejunction portion and the gate capacitor according to this embodiment, acapacitor between interconnection lines of polycrystal silicon and metalinterconnection lines such as aluminum and copper may be utilized toemploy as the power supply interconnection capacitor of this embodiment.

Although the dummy provided for the active region and the gateinterconnection is employed in this embodiment, a similar dummy may bearranged for other interconnection lines. In this case, potential may besupplied to the dummy to be utilized as a capacitor between otherinterconnection lines.

Although the region of the dummy is utilized as the capacitor in thisembodiment, the region may be utilized as shield by supplying potentialto it. Supply of potential to the dummy region is important in theembodiment, the layer supplied with the potential may be utilized as thecapacitor or as the shield.

Although the inverter is employed for convenience of description in thisembodiment, what is utilized as a circuit is not limited to the inverterand any circuit element may be employed.

Further, the dummy may be applied to the structure shown in FIG. 70.

Referring to FIG. 70, if a layer of a bit line of a DRAM is utilized asinterconnection, especially as interconnection for supplyinghigh-precision DC potential, the influence of noises on the circuitelements is a problem. In this case, shield may be provided by arranginga dummy bit line around a bit line interconnection and a bit line usedfor the circuit portion, and covering the bit line interconnection witha dummy of a gate interconnection layer at a lower layer of the bit lineand a dummy of an aluminum interconnection layer at a higher layer ofthe bit line.

Although the present invention has been described and illustrated indetail, it is clearly understood that the same is by way of illustrationand example only and is not to be taken by way of limitation, the spiritand scope of the present invention being limited only by the terms ofthe appended claims.

What is claimed is:
 1. A semiconductor integrated circuit devicecomprising: a main power supply line; a sub-power supply line; couplingmeans for electrically coupling said main power supply line and saidsub-power supply line in an active cycle and for electrically uncouplingsaid main power supply line and said sub-power supply line in a standbycycle; a logic circuit including a first logic gate operating withvoltage on said main power supply line as an operation supply voltage,applying a prescribed logical processing based on a supplied input andoutputting a resultant one, and a second logic gate operating withvoltage on said sub-power supply line as an operation supply voltage,applying a prescribed logical processing based on a supplied input andoutputting a resultant one; and voltage control means for controllingthe voltage on said main power supply line to apply to said logiccircuit a prescribed operation supply voltage required for ensuringoperation of said logic circuit in said active cycle.
 2. Thesemiconductor integrated circuit device according to claim 1, whereinsaid voltage control means includes amplify means for amplifying adifference between a reference voltage which is higher than saidprescribed operation supply voltage of a higher potential required forensuring the operation of said logic circuit, and the voltage on saidmain power supply line.
 3. The semiconductor integrated circuit deviceaccording to claim 1, wherein said voltage control means includesamplify means for amplifying a difference between a reference voltagewhich is lower than said prescribed operation supply voltage of a lowerpotential required for ensuring the operation of said logic circuit, andthe voltage on said main power supply line.
 4. The semiconductorintegrated circuit device according to claim 1, wherein said main powersupply line includes: a first main power supply line corresponding tosaid prescribed operation supply voltage of a higher potential requiredfor ensuring the operation of said logic circuit; and a second mainpower supply line corresponding to said prescribed operation supplyvoltage of a lower potential required for ensuring the operation of saidlogic circuit, said sub-power supply line includes: a first sub-powersupply line corresponding to said first main power supply line; and asecond sub-power supply line corresponding to said second main powersupply line, said coupling means includes: a first coupling circuit forshort-circuiting said first main power supply line and said firstsub-power supply line; and a second coupling circuit forshort-circuiting said second main power supply line and said secondsub-power supply line, said first logic gate operates with voltage onsaid first main power supply line and voltage on said second sub-powersupply line as an operation supply voltage, said second logic gateoperates with voltage on said second main power supply line and voltageon said first sub-power supply line as an operation supply voltage, andsaid voltage control means includes: a first amplify means foramplifying a difference between a reference voltage which is higher thansaid prescribed operation supply voltage of a higher potential, and thevoltage on said first main power supply line; and a second amplify meansfor amplifying a difference between a reference voltage which is lowerthan said prescribed operation supply voltage of a lower potential, andthe voltage on said second main power supply line.
 5. The semiconductorintegrated circuit device according to claim 1, wherein said voltagecontrol means includes: first amplify means for amplifying a differencebetween a first reference voltage which corresponds to said prescribedoperation supply voltage required for ensuring the operation of saidlogic circuit, and the voltage on said main power supply line in saidactive cycle; and second amplify means for amplifying a differencebetween a second reference voltage which is different from said firstreference voltage, and the voltage on said main power supply line insaid standby cycle.
 6. The semiconductor integrated circuit deviceaccording to claim 1, wherein said coupling means is formed of at leastone switching transistor which attains an ON state in said active cycle.7. The semiconductor integrated circuit device according to claim 1,wherein said coupling means includes at least one voltage hold means,and each of said at least one voltage hold means maintains the voltageon said sub-power supply line at the voltage on said main power supplyline in said active cycle.
 8. The semiconductor integrated circuitdevice according to claim 1, further comprising a transistor placed anddiode-connected between said main power supply line and said sub-powersupply line.
 9. The semiconductor integrated circuit device according toclaim 1, further comprising control means for generating an internaloperation control signal designating said active cycle of said logiccircuit in response to an operation designate signal which is externallysupplied, wherein said coupling means performs coupling/uncouplingoperation in response to said internal operation control signal.
 10. Thesemiconductor integrated circuit device according to claim 1, furthercomprising control means for generating an internal operation controlsignal designating said active cycle of said logic circuit in responseto an operation designate signal which is externally supplied, whereinsaid voltage control means and said coupling means operate in responseto said internal operation control signal.
 11. The semiconductorintegrated circuit device according to claim 1, further comprising:control means for detecting a specific mode in response to an externallysupplied operation designate signal; and means for adjusting a controllevel of voltage of said voltage control means in response to detectionof said specific mode.
 12. The semiconductor integrated circuit deviceaccording to claim 1, further comprising: control means for detecting aspecific test mode in response to an externally supplied operationdesignate signal; means for adjusting a control level of voltage of saidvoltage control means in response to detection of said specific testmode; and means for monitoring leakage current in said logic circuit.13. The semiconductor integrated circuit device according to claim 1,further comprising switch control means for controlling ON/OFF of saidswitching transistor, wherein said coupling means is formed of aswitching transistor which attains ON state in said active cycle, andsaid switch control means applies negative bias to a gate electrode ofsaid switching transistor in said standby cycle.
 14. A semiconductorintegrated circuit device comprising: a main power supply line; asub-power supply line; coupling means for electrically coupling saidmain power supply line and said sub-power supply line in an active cycleand for electrically uncoupling said main power supply line and saidsub-power supply line in a standby cycle; a logic circuit including afirst logic gate operating with voltage on said main power supply lineas an operation supply voltage, applying a prescribed logical processingbased on a supplied input and outputting a resultant one, and a secondlogic gate operating with voltage on said sub-power supply line as anoperation supply voltage, applying a prescribed logical processing basedon a supplied input and outputting a resultant one; and monitoring meansfor monitoring leakage current in said logic circuit.
 15. Asemiconductor integrated circuit device comprising: a semiconductorsubstrate having a main surface; a main power supply line and asub-power supply line separately extending on the main surface of saidsemiconductor substrate; coupling means for electrically coupling saidmain power supply line and said sub-power supply line in an active cycleand for electrically uncoupling said main power supply line and saidsub-power supply line in a standby cycle; a logic circuit including afirst logic gate operating with voltage of said main power supply lineas an operation supply voltage, applying a prescribed logical processingbased on a supplied input and outputting a resultant one, and a secondlogic gate operating with voltage of said sub-power supply line as anoperation supply voltage, applying a prescribed logical processing basedon a supplied input and outputting a resultant one; a first impurityregion formed in said semiconductor substrate to be electricallyconnected to a portion of at least one of said main power supply lineand said sub-power supply line extending between said coupling means andsaid logic circuit; and a second impurity region formed in saidsemiconductor substrate to form pn junction between said first impurityregion and itself.
 16. The semiconductor integrated circuit deviceaccording to claim 15, wherein said first and second impurity regionsare formed to form a junction capacitance.
 17. The semiconductorintegrated circuit device according to claim 16, wherein said junctioncapacitance is formed between the potentials of the same value and withdifferent phases.
 18. The semiconductor integrated circuit deviceaccording to claim 16, wherein said junction capacitance is formedbetween an impurity region electrically connected to said main powersupply line and an impurity region electrically connected to saidsub-power supply line.
 19. The semiconductor integrated circuit deviceaccording to claim 16, wherein said junction capacitance is formedbetween an impurity region receiving Vcc potential and an impurityregion receiving Vss potential.